Air Filters and Chemical Filtration

ePTFE Membrane ULPA Filter

An ultra-clean ePTFE membrane panel offering U15 or U16 efficiency options, low pressure drop and reduced ionic or fibre emissions for semiconductor processes.

U15–U16 ePTFE Media
Boron-Free Filtration Layer
Low Pressure Drop
Low-Outgassing Construction

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Product Introduction

The ePTFE membrane ULPA filter uses an expanded-polytetrafluoroethylene membrane laminated to a stable support and formed into closely controlled mini-pleats. The non-borosilicate filtration layer reduces fibre shedding and avoids boron from conventional glass media, while the thin membrane structure can deliver lower resistance at ultra-high efficiency. Low-outgassing separators and polyurethane potting secure the pack in an anodized-aluminium frame. Gel, gasket or knife-edge versions integrate with semiconductor cleanroom ceilings, fan filter units and process-tool mini-environments.

Key Features

Expanded PTFE membrane supports U15 or U16 configurations without an exposed borosilicate fibre surface.

The thin membrane layer provides a favorable pressure-drop profile for high-recirculation cleanroom systems.

Hydrophobic media resists brief moisture exposure and many routine cleanroom decontamination chemicals.

Low-outgassing pack supports, potting and frame materials limit avoidable molecular emissions near process tools.

Customer Product Concerns

Ultra-clean semiconductor processes need U-class particle control without adding boron, fibres or excessive recirculation-fan resistance.

Borosilicate media contributes unwanted ionic material near a sensitive process.The ePTFE filtration layer avoids conventional glass-fibre media in the active capture surface.

U-class efficiency consumes too much pressure in a continuously recirculated cleanroom.The high-porosity membrane and optimized pleat area reduce resistance at the selected face velocity.

Fibres released from the downstream face affect optics or wafer surfaces.A supported non-fibrous membrane presents a clean downstream filtration surface.

Filter construction materials add VOCs to a low-outgassing process environment.Selected separators, potting and frame components minimize avoidable material emissions.

Typical Applications

Advanced semiconductor fabricationPhotolithography process baysOLED and flat-panel manufacturingPrecision optics assemblyLow-outgassing equipment mini-environments

Technical Parameters

Representative construction ranges for ePTFE membrane ULPA panels are shown below.

Core Material	Supported expanded-PTFE membrane ULPA media with low-outgassing polymer separators
Panel Thickness	65–150 mm overall aluminium-frame depth
Effective Width	305–610 mm nominal face width
Maximum Length	Up to 1220 mm nominal face length
Steel Facing Thickness	0.4–0.6 mm low-shedding stainless-steel or coated protective grid
Core Density	Approximately 20–35 kg/m³ equivalent ePTFE membrane-pack density
Thermal Conductivity	Approximately 0.030–0.040 W/(m·K) for the dry supported membrane pack
Surface Finish	Clean natural-anodized aluminium with semiconductor-grade low-shedding faceguards
Joint Type	Polyurethane gel, closed-cell gasket or extruded knife-edge perimeter seal
Customization	Available based on the intended application and operating environment.

Available Options

U15 or U16 membrane efficiency65 mm, 90 mm or 150 mm frame depthGel, gasket or knife-edge sealLow-outgassing semiconductor component package

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