Three-quarter view of ePTFE membrane ULPA filter for semiconductor cleanrooms

Воздушные фильтры и химическая фильтрация

ePTFE мембрана ULPA фильтр

An ultra-clean ePTFE membrane panel offering U15 or U16 efficiency options, low pressure drop and reduced ionic or fibre emissions for semiconductor processes.

U15–U16 ePTFE Media
Boron-Free Filtration Layer
Low Pressure Drop
Low-Outgassing Construction

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Введение продукции

The ePTFE membrane ULPA filter uses an expanded-polytetrafluoroethylene membrane laminated to a stable support and formed into closely controlled mini-pleats. The non-borosilicate filtration layer reduces fibre shedding and avoids boron from conventional glass media, while the thin membrane structure can deliver lower resistance at ultra-high efficiency. Low-outgassing separators and polyurethane potting secure the pack in an anodized-aluminium frame. Gel, gasket or knife-edge versions integrate with semiconductor cleanroom ceilings, fan filter units and process-tool mini-environments.

Основные характеристики

Expanded PTFE membrane supports U15 or U16 configurations without an exposed borosilicate fibre surface.

The thin membrane layer provides a favorable pressure-drop profile for high-recirculation cleanroom systems.

Hydrophobic media resists brief moisture exposure and many routine cleanroom decontamination chemicals.

Low-outgassing pack supports, potting and frame materials limit avoidable molecular emissions near process tools.

Обеспокоенность клиентов продуктами

Ultra-clean semiconductor processes need U-class particle control without adding boron, fibres or excessive recirculation-fan resistance.

Borosilicate media contributes unwanted ionic material near a sensitive process.The ePTFE filtration layer avoids conventional glass-fibre media in the active capture surface.

U-class efficiency consumes too much pressure in a continuously recirculated cleanroom.The high-porosity membrane and optimized pleat area reduce resistance at the selected face velocity.

Fibres released from the downstream face affect optics or wafer surfaces.A supported non-fibrous membrane presents a clean downstream filtration surface.

Filter construction materials add VOCs to a low-outgassing process environment.Selected separators, potting and frame components minimize avoidable material emissions.

Типичные приложения

Advanced semiconductor fabricationPhotolithography process baysOLED and flat-panel manufacturingPrecision optics assemblyLow-outgassing equipment mini-environments

Технические параметры

Representative construction ranges for ePTFE membrane ULPA panels are shown below.

Основной материал	Supported expanded-PTFE membrane ULPA media with low-outgassing polymer separators
Толщина панели	65–150 mm overall aluminium-frame depth
эффективная ширина	305–610 mm nominal face width
Максимальная длина	Up to 1220 mm nominal face length
Толщина линий стали	0.4–0.6 mm low-shedding stainless-steel or coated protective grid
Плотность ядра	Approximately 20–35 kg/m³ equivalent ePTFE membrane-pack density
Теплопроводимость	Approximately 0.030–0.040 W/(m·K) for the dry supported membrane pack
Поверхностная отделка	Clean natural-anodized aluminium with semiconductor-grade low-shedding faceguards
Объединенный тип	Polyurethane gel, closed-cell gasket or extruded knife-edge perimeter seal
Customization	Доступно в зависимости от предполагаемого применения и операционной среды.

Доступные варианты

U15 or U16 membrane efficiency65 mm, 90 mm or 150 mm frame depthGel, gasket or knife-edge sealLow-outgassing semiconductor component package

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