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Luftfilter und chemische Filtration
ePTFE Membran ULPA Filter
An ultra-clean ePTFE membrane panel offering U15 or U16 efficiency options, low pressure drop and reduced ionic or fibre emissions for semiconductor processes.
- U15–U16 ePTFE Media
- Boron-Free Filtration Layer
- Low Pressure Drop
- Low-Outgassing Construction
Produkteinführung
The ePTFE membrane ULPA filter uses an expanded-polytetrafluoroethylene membrane laminated to a stable support and formed into closely controlled mini-pleats. The non-borosilicate filtration layer reduces fibre shedding and avoids boron from conventional glass media, while the thin membrane structure can deliver lower resistance at ultra-high efficiency. Low-outgassing separators and polyurethane potting secure the pack in an anodized-aluminium frame. Gel, gasket or knife-edge versions integrate with semiconductor cleanroom ceilings, fan filter units and process-tool mini-environments.
Key Features
The thin membrane layer provides a favorable pressure-drop profile for high-recirculation cleanroom systems.
Hydrophobic media resists brief moisture exposure and many routine cleanroom decontamination chemicals.
Low-outgassing pack supports, potting and frame materials limit avoidable molecular emissions near process tools.
Kunden Produktbedenken
Ultra-clean semiconductor processes need U-class particle control without adding boron, fibres or excessive recirculation-fan resistance.
Borosilicate media contributes unwanted ionic material near a sensitive process.The ePTFE filtration layer avoids conventional glass-fibre media in the active capture surface.
U-class efficiency consumes too much pressure in a continuously recirculated cleanroom.The high-porosity membrane and optimized pleat area reduce resistance at the selected face velocity.
Fibres released from the downstream face affect optics or wafer surfaces.A supported non-fibrous membrane presents a clean downstream filtration surface.
Filter construction materials add VOCs to a low-outgassing process environment.Selected separators, potting and frame components minimize avoidable material emissions.
Typische Anwendungen
Advanced semiconductor fabricationPhotolithography process baysOLED and flat-panel manufacturingPrecision optics assemblyLow-outgassing equipment mini-environments
Technische Parameter
Representative construction ranges for ePTFE membrane ULPA panels are shown below.
| Core Material | Supported expanded-PTFE membrane ULPA media with low-outgassing polymer separators |
|---|---|
| Panel Dicke | 65–150 mm overall aluminium-frame depth |
| Effektive Breite | 305 - 610 mm Nenngesichtbreite |
| Maximale Länge | Bis zu 1220 mm Nennfläche |
| Stahl facing Dicke | 0.4–0.6 mm low-shedding stainless-steel or coated protective grid |
| Kerndichte | Approximately 20–35 kg/m³ equivalent ePTFE membrane-pack density |
| Thermische Leitfähigkeit | Approximately 0.030–0.040 W/(m·K) for the dry supported membrane pack |
| Oberfläche Finish | Clean natural-anodized aluminium with semiconductor-grade low-shedding faceguards |
| Gemeinsamer Typ | Polyurethane gel, closed-cell gasket or extruded knife-edge perimeter seal |
| Customisierung | Verfügbar je nach beabsichtigter Anwendung und Betriebsumgebung. |
Verfügbare Optionen
U15 or U16 membrane efficiency65 mm, 90 mm or 150 mm frame depthGel, gasket or knife-edge sealLow-outgassing semiconductor component package
Planning a ePTFE Membrane ULPA Filter specification?
Senden Sie uns Ihre Abmessungen, Installationsbedingungen, Leistungsziele und gewünschte Oberflächenveredelung.
