Carregamento de material Booth
- Process Inlet Integration
- Contained Charging Zone
- Bag and Drum Handling
- Low-Level Dust Return
Introdução do produto
The charging booth surrounds the feed opening of a mixer, reactor, hopper or intermediate vessel. A raised platform, charging chute or flexible connection positions the process inlet within the protected downflow zone. Operators open bags or containers above the inlet while rear or side returns capture displaced dust. Lifts, hoists and empty-bag disposal ports can be integrated so charging steps remain inside one organized enclosure.
Características-chave
Flexible or rigid feed interfaces reduce the open gap between container and vessel.
Low return grilles collect dust displaced upward from the receiving vessel.
Hoists or bag lifters can move heavy containers into the charging position.
A dedicated empty-bag port separates waste handling from the product inlet.
Preocupações do produto do cliente
Vessel charging releases air and powder from the receiving inlet while operators handle heavy source containers above the process opening.
Aplicações típicas
Parâmetros técnicos
Typical configurable construction ranges for a material charging booth are listed below.
| Material principal | SUS304 or SUS316L process-zone panels with mineral-wool insulated outer enclosure and reinforced charging platform |
|---|---|
| Painel de espessura | 75-100 mm insulated booth panels |
| Largura efetiva | 1800-4500 mm clear charging width |
| Comprimento máximo | Up to 6500 mm booth depth |
| Aço enfrentando espessura | 1.2-2.0 mm stainless process facing; 1.0-1.2 mm outer steel |
| Densidade Core | 100-140 kg/m³ mineral-wool core |
| Condutividade térmica | 0.035-0.045 W/(m·K) for the mineral-wool core |
| Superfície acabado | Fine-brushed stainless process surfaces with sealed powder-coated outer panels |
| Tipo conjunto | Pressure-sealed booth panels with reinforced vessel interface, flexible sleeve or welded charging chute |
| Customização | Disponível com base na aplicação pretendida e no ambiente operacional. |
Opções disponíveis
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