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Acessórios de instalação de sala limpa
Composto de Reparação Epoxy
A two-component resin-and-hardener repair compound for rebuilding small damaged areas before sanding and hygienic surface finishing.
- Metered Two-Part Mixing
- Low-Shrink Hard Cure
- Sandable Repair Surface
- Multi-Substrate Bonding
Introdução do produto
Epoxy repair compound combines resin and hardener at a controlled ratio to form a dense thermoset repair material. Dual-cartridge packaging meters both components through a static mixer, reducing incomplete blending on small maintenance jobs. The mixed compound wets properly prepared metal, concrete and rigid panel surfaces, fills chips or localized voids and cures to a hard profile that can be shaped, sanded and overcoated with a compatible hygienic finish.
Características-chave
The static mixer produces a uniform blend without a separate mixing cup.
Low curing shrinkage helps the patch retain contact with sound repair edges.
The hardened surface can be machined or sanded before compatible topcoat application.
Preocupações do produto do cliente
A localized cleanroom repair must bond to a carefully prepared substrate and finish flush without leaving a porous or dirt-catching patch.
Hand-proportioned resin and hardener can remain soft when the ratio is inaccurate.Matched dual cartridges meter both components before they enter the static mixing element.
Oil, dust or weak coating prevents a repair from anchoring to the base material.The defect is cut back to sound material, degreased and mechanically keyed before application.
A proud or rough patch creates a ledge that is difficult to clean.The cured compound is shaped and sanded flush, then closed with a compatible smooth finish.
Large deep fills can overheat or cure unevenly during the exothermic reaction.Repair depth and batch size are limited to the selected grade, with deeper voids rebuilt in controlled stages.
Aplicações típicas
Cleanroom panel chip repairLocalized coated-metal defect fillingConcrete floor edge restorationEquipment base and curb repairsRigid frame and trim rebuilding
Parâmetros técnicos
Typical construction and application ranges for a cartridge-dispensed two-component epoxy repair compound are listed below.
| Material principal | Two-component epoxy resin and amine hardener with mineral reinforcement |
|---|---|
| Painel de espessura | 1-25 mm practical repair layer thickness |
| Largura efetiva | 5-100 mm typical localized repair width |
| Comprimento máximo | Up to 1000 mm continuous localized repair strip per application |
| Aço enfrentando espessura | 0.50-2.00 mm compatible steel repair substrate thickness |
| Densidade Core | Approximately 1400-2000 kg/m³ mixed compound density |
| Condutividade térmica | Approximately 0.30-0.80 W/(m·K) for cured filled epoxy |
| Superfície acabado | Dense sandable gray or off-white surface suitable for compatible overcoating |
| Tipo conjunto | Bonded chip, crack, edge or shallow-void repair on sound prepared substrate |
| Customização | Disponível com base na aplicação pretendida e no ambiente operacional. |
Opções disponíveis
Dual cartridge or hand-mix packFast or extended working timeGray or off-white compoundStatic mixer and application spatula kit
Planning a Epoxy Repair Compound specification?
Envie-nos as suas dimensões, condições de instalação, metas de desempenho e acabamento de superfície necessário.
