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Aksesori Pemasangan Bilik Bersih

Kompaun Pembaikan Epoxy

A two-component resin-and-hardener repair compound for rebuilding small damaged areas before sanding and hygienic surface finishing.
  • Metered Two-Part Mixing
  • Low-Shrink Hard Cure
  • Sandable Repair Surface
  • Multi-Substrate Bonding
Permintaan sebut harga Semak imbas produk

Pengenalan Produk

Epoxy repair compound combines resin and hardener at a controlled ratio to form a dense thermoset repair material. Dual-cartridge packaging meters both components through a static mixer, reducing incomplete blending on small maintenance jobs. The mixed compound wets properly prepared metal, concrete and rigid panel surfaces, fills chips or localized voids and cures to a hard profile that can be shaped, sanded and overcoated with a compatible hygienic finish.

Ciri-ciri Utama

Dual-barrel dispensing maintains the intended resin-to-hardener proportion for repeatable small repairs.

The static mixer produces a uniform blend without a separate mixing cup.

Low curing shrinkage helps the patch retain contact with sound repair edges.

The hardened surface can be machined or sanded before compatible topcoat application.

Kebimbangan Produk Pelanggan

A localized cleanroom repair must bond to a carefully prepared substrate and finish flush without leaving a porous or dirt-catching patch.

Hand-proportioned resin and hardener can remain soft when the ratio is inaccurate.Matched dual cartridges meter both components before they enter the static mixing element.
Oil, dust or weak coating prevents a repair from anchoring to the base material.The defect is cut back to sound material, degreased and mechanically keyed before application.
A proud or rough patch creates a ledge that is difficult to clean.The cured compound is shaped and sanded flush, then closed with a compatible smooth finish.
Large deep fills can overheat or cure unevenly during the exothermic reaction.Repair depth and batch size are limited to the selected grade, with deeper voids rebuilt in controlled stages.

Permohonan yang biasa

Cleanroom panel chip repairLocalized coated-metal defect fillingConcrete floor edge restorationEquipment base and curb repairsRigid frame and trim rebuilding

Parameter teknikal

Typical construction and application ranges for a cartridge-dispensed two-component epoxy repair compound are listed below.

Bahan TerasTwo-component epoxy resin and amine hardener with mineral reinforcement
Ketebalan Panel1-25 mm practical repair layer thickness
Lebar berkesan5-100 mm typical localized repair width
Panjang maksimumUp to 1000 mm continuous localized repair strip per application
Keluli Menghadapi Ketebalan0.50-2.00 mm compatible steel repair substrate thickness
Ketumpatan terasApproximately 1400-2000 kg/m³ mixed compound density
Kekonduksian TermaApproximately 0.30-0.80 W/(m·K) for cured filled epoxy
Kemasan permukaanDense sandable gray or off-white surface suitable for compatible overcoating
Jenis BersatuBonded chip, crack, edge or shallow-void repair on sound prepared substrate
PenyesuaianBoleh didapati berdasarkan aplikasi yang dimaksudkan dan persekitaran operasi.

Pilihan yang boleh didapati

Dual cartridge or hand-mix packFast or extended working timeGray or off-white compoundStatic mixer and application spatula kit

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