Three-quarter view of a two-part epoxy repair compound cartridge, mixer and spatula

클린룸 설치 액세서리

에폭시 수리 화합물

A two-component resin-and-hardener repair compound for rebuilding small damaged areas before sanding and hygienic surface finishing.

Metered Two-Part Mixing
Low-Shrink Hard Cure
Sandable Repair Surface
Multi-Substrate Bonding

견적 요청 제품 찾아보기

상품 소개

Epoxy repair compound combines resin and hardener at a controlled ratio to form a dense thermoset repair material. Dual-cartridge packaging meters both components through a static mixer, reducing incomplete blending on small maintenance jobs. The mixed compound wets properly prepared metal, concrete and rigid panel surfaces, fills chips or localized voids and cures to a hard profile that can be shaped, sanded and overcoated with a compatible hygienic finish.

주요 기능

Dual-barrel dispensing maintains the intended resin-to-hardener proportion for repeatable small repairs.

The static mixer produces a uniform blend without a separate mixing cup.

Low curing shrinkage helps the patch retain contact with sound repair edges.

The hardened surface can be machined or sanded before compatible topcoat application.

고객 제품 관심사

A localized cleanroom repair must bond to a carefully prepared substrate and finish flush without leaving a porous or dirt-catching patch.

Hand-proportioned resin and hardener can remain soft when the ratio is inaccurate.Matched dual cartridges meter both components before they enter the static mixing element.

Oil, dust or weak coating prevents a repair from anchoring to the base material.The defect is cut back to sound material, degreased and mechanically keyed before application.

A proud or rough patch creates a ledge that is difficult to clean.The cured compound is shaped and sanded flush, then closed with a compatible smooth finish.

Large deep fills can overheat or cure unevenly during the exothermic reaction.Repair depth and batch size are limited to the selected grade, with deeper voids rebuilt in controlled stages.

일반적인 응용 프로그램

Cleanroom panel chip repairLocalized coated-metal defect fillingConcrete floor edge restorationEquipment base and curb repairsRigid frame and trim rebuilding

기술 매개변수

Typical construction and application ranges for a cartridge-dispensed two-component epoxy repair compound are listed below.

핵심 재료	Two-component epoxy resin and amine hardener with mineral reinforcement
패널 두께	1-25 mm practical repair layer thickness
유효 폭	5-100 mm typical localized repair width
최대 길이	Up to 1000 mm continuous localized repair strip per application
강철 면면 두께	0.50-2.00 mm compatible steel repair substrate thickness
코어 밀도	Approximately 1400-2000 kg/m³ mixed compound density
열전도도 (Thermal Conductivity)	Approximately 0.30-0.80 W/(m·K) for cured filled epoxy
표면 마무리	Dense sandable gray or off-white surface suitable for compatible overcoating
접합 유형	Bonded chip, crack, edge or shallow-void repair on sound prepared substrate
사용자 정의	의도된 응용 프로그램 및 운영 환경에 따라 사용할 수 있습니다.

사용 가능한 옵션

Dual cartridge or hand-mix packFast or extended working timeGray or off-white compoundStatic mixer and application spatula kit

Planning a Epoxy Repair Compound specification?

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