Composé de réparation époxy
- Metered Two-Part Mixing
- Low-Shrink Hard Cure
- Sandable Repair Surface
- Multi-Substrate Bonding
Introduction de produit
Epoxy repair compound combines resin and hardener at a controlled ratio to form a dense thermoset repair material. Dual-cartridge packaging meters both components through a static mixer, reducing incomplete blending on small maintenance jobs. The mixed compound wets properly prepared metal, concrete and rigid panel surfaces, fills chips or localized voids and cures to a hard profile that can be shaped, sanded and overcoated with a compatible hygienic finish.
Key Features
The static mixer produces a uniform blend without a separate mixing cup.
Low curing shrinkage helps the patch retain contact with sound repair edges.
The hardened surface can be machined or sanded before compatible topcoat application.
Préoccupations du client produit
A localized cleanroom repair must bond to a carefully prepared substrate and finish flush without leaving a porous or dirt-catching patch.
Les applications typiques
Paramètres techniques
Typical construction and application ranges for a cartridge-dispensed two-component epoxy repair compound are listed below.
| Matériaux de base | Two-component epoxy resin and amine hardener with mineral reinforcement |
|---|---|
| Panneau épaisseur | 1-25 mm practical repair layer thickness |
| Largeur effective | 5-100 mm typical localized repair width |
| Longueur maximale | Up to 1000 mm continuous localized repair strip per application |
| Acier face épaisseur | 0.50-2.00 mm compatible steel repair substrate thickness |
| Densité Core | Approximately 1400-2000 kg/m³ mixed compound density |
| Conductivité thermique | Approximately 0.30-0.80 W/(m·K) for cured filled epoxy |
| surface finie | Dense sandable gray or off-white surface suitable for compatible overcoating |
| Type joint | Bonded chip, crack, edge or shallow-void repair on sound prepared substrate |
| Customisation | Disponible en fonction de l'application prévue et de l'environnement d'exploitation. |
Options disponibles
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