Эпоксидный ремонтный соединение
- Metered Two-Part Mixing
- Low-Shrink Hard Cure
- Sandable Repair Surface
- Multi-Substrate Bonding
Введение продукции
Epoxy repair compound combines resin and hardener at a controlled ratio to form a dense thermoset repair material. Dual-cartridge packaging meters both components through a static mixer, reducing incomplete blending on small maintenance jobs. The mixed compound wets properly prepared metal, concrete and rigid panel surfaces, fills chips or localized voids and cures to a hard profile that can be shaped, sanded and overcoated with a compatible hygienic finish.
Основные характеристики
The static mixer produces a uniform blend without a separate mixing cup.
Low curing shrinkage helps the patch retain contact with sound repair edges.
The hardened surface can be machined or sanded before compatible topcoat application.
Обеспокоенность клиентов продуктами
A localized cleanroom repair must bond to a carefully prepared substrate and finish flush without leaving a porous or dirt-catching patch.
Типичные приложения
Технические параметры
Typical construction and application ranges for a cartridge-dispensed two-component epoxy repair compound are listed below.
| Основной материал | Two-component epoxy resin and amine hardener with mineral reinforcement |
|---|---|
| Толщина панели | 1-25 mm practical repair layer thickness |
| эффективная ширина | 5-100 mm typical localized repair width |
| Максимальная длина | Up to 1000 mm continuous localized repair strip per application |
| Толщина линий стали | 0.50-2.00 mm compatible steel repair substrate thickness |
| Плотность ядра | Approximately 1400-2000 kg/m³ mixed compound density |
| Теплопроводимость | Approximately 0.30-0.80 W/(m·K) for cured filled epoxy |
| Поверхностная отделка | Dense sandable gray or off-white surface suitable for compatible overcoating |
| Объединенный тип | Bonded chip, crack, edge or shallow-void repair on sound prepared substrate |
| Customization | Доступно в зависимости от предполагаемого применения и операционной среды. |
Доступные варианты
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