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مرشحات الهواء والترشيح الكيميائي
Low-Boron فلتر HEPA
A semiconductor-oriented HEPA panel using ePTFE or specially selected low-boron media and low-outgassing components to reduce airborne ionic contamination near sensitive processes.
- Low-Boron Media Selection
- Low-Outgassing Components
- Semiconductor Cleanroom Use
- Mini-Pleat Panel Design
مقدمة المنتج
The low-boron HEPA filter is designed for cleanroom zones where conventional borosilicate glass media may contribute trace ionic contaminants. A supported ePTFE membrane or qualified low-boron media is formed into a compact mini-pleat pack and bonded into an anodized-aluminium frame. Low-outgassing separators, polyurethane potting and gasket materials are selected to limit avoidable emissions from the assembled filter. The finished panel fits fan filter units, tool enclosures and recirculation modules serving lithography, wafer processing and other contamination-sensitive operations.
الخصائص الرئيسية
Low-outgassing separators and potting compounds support use close to sensitive wafer and optics processes.
An anodized-aluminium frame provides a clean, non-shedding perimeter with stable seal geometry.
Mini-pleat construction supplies a broad active area within the shallow profile used by cleanroom terminals.
مخاوف المنتج للعملاء
Trace ionic and molecular emissions from filter materials can matter when the process operates at semiconductor contamination limits.
Conventional microglass media introduces an avoidable boron source near wafer processing.A supported ePTFE or selected low-boron pack removes the standard borosilicate media from the active filtration layer.
Adhesives and separators release volatile compounds into recirculated cleanroom air.Low-outgassing component choices reduce emissions from materials surrounding the filter pack.
Particles are released from unfinished frame surfaces during installation.Smooth anodized aluminium and sealed corners provide a cleanable, non-shedding perimeter.
A process-tool enclosure has limited space for a deep final filter.The shallow mini-pleat format fits common FFU and equipment-terminal depths.
تطبيقات نموذجية
Semiconductor wafer fabricationPhotolithography clean baysFlat-panel display productionHard-disk media manufacturingContamination-sensitive tool mini-environments
المعلمات الفنية
Typical construction ranges for a low-boron semiconductor HEPA panel are shown below.
| المواد الأساسية | Supported ePTFE membrane or specially selected low-boron HEPA media |
|---|---|
| سمك اللوحة | 66–90 mm overall frame depth |
| العرض الفعال | 305-610 مم عرض الوجه الاسمي |
| الحد الأقصى الطول | ما يصل إلى 1220 مم طول الوجه الاسمي |
| الصلب يواجه سمك | 0.4–0.6 mm low-shedding stainless-steel or coated faceguard |
| الكثافة الأساسية | Approximately 20–35 kg/m³ equivalent membrane-pack density |
| الموصلية الحرارية | Approximately 0.031–0.041 W/(m·K) for the dry low-boron membrane pack |
| إنهاء السطح | Natural anodized aluminium with low-outgassing white or stainless protective grid |
| نوع المشترك | Polyurethane gel channel, closed-cell gasket or extruded knife-edge seal |
| التخصيص | متوفر على أساس التطبيق المقصود وبيئة التشغيل. |
الخيارات المتاحة
H13 or H14 low-boron mediaهلام ، طوقا أو ختم حافة السكينLow-outgassing cleanroom component setشبكة واقية من جانب واحد أو من جانبين
Planning a Low-Boron HEPA Filter specification?
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