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Filtres à air et filtration chimique
Filtre HEPA à faible teneur en bore
A semiconductor-oriented HEPA panel using ePTFE or specially selected low-boron media and low-outgassing components to reduce airborne ionic contamination near sensitive processes.
- Low-Boron Media Selection
- Low-Outgassing Components
- Semiconductor Cleanroom Use
- Mini-Pleat Panel Design
Introduction de produit
The low-boron HEPA filter is designed for cleanroom zones where conventional borosilicate glass media may contribute trace ionic contaminants. A supported ePTFE membrane or qualified low-boron media is formed into a compact mini-pleat pack and bonded into an anodized-aluminium frame. Low-outgassing separators, polyurethane potting and gasket materials are selected to limit avoidable emissions from the assembled filter. The finished panel fits fan filter units, tool enclosures and recirculation modules serving lithography, wafer processing and other contamination-sensitive operations.
Key Features
Low-outgassing separators and potting compounds support use close to sensitive wafer and optics processes.
An anodized-aluminium frame provides a clean, non-shedding perimeter with stable seal geometry.
Mini-pleat construction supplies a broad active area within the shallow profile used by cleanroom terminals.
Préoccupations du client produit
Trace ionic and molecular emissions from filter materials can matter when the process operates at semiconductor contamination limits.
Conventional microglass media introduces an avoidable boron source near wafer processing.A supported ePTFE or selected low-boron pack removes the standard borosilicate media from the active filtration layer.
Adhesives and separators release volatile compounds into recirculated cleanroom air.Low-outgassing component choices reduce emissions from materials surrounding the filter pack.
Particles are released from unfinished frame surfaces during installation.Smooth anodized aluminium and sealed corners provide a cleanable, non-shedding perimeter.
A process-tool enclosure has limited space for a deep final filter.The shallow mini-pleat format fits common FFU and equipment-terminal depths.
Les applications typiques
Semiconductor wafer fabricationPhotolithography clean baysFlat-panel display productionHard-disk media manufacturingContamination-sensitive tool mini-environments
Paramètres techniques
Typical construction ranges for a low-boron semiconductor HEPA panel are shown below.
| Matériaux de base | Supported ePTFE membrane or specially selected low-boron HEPA media |
|---|---|
| Panneau épaisseur | 66–90 mm overall frame depth |
| Largeur effective | 305 - 610 mm Largeur nominale du visage |
| Longueur maximale | Jusqu'à 1220 mm de longueur nominale du visage |
| Acier face épaisseur | 0.4–0.6 mm low-shedding stainless-steel or coated faceguard |
| Densité Core | Approximately 20–35 kg/m³ equivalent membrane-pack density |
| Conductivité thermique | Approximately 0.031–0.041 W/(m·K) for the dry low-boron membrane pack |
| surface finie | Natural anodized aluminium with low-outgassing white or stainless protective grid |
| Type joint | Polyurethane gel channel, closed-cell gasket or extruded knife-edge seal |
| Customisation | Disponible en fonction de l'application prévue et de l'environnement d'exploitation. |
Options disponibles
H13 or H14 low-boron mediaGel, joint ou joint à tranchant de couteauLow-outgassing cleanroom component setGrille de protection unilatérale ou bilatérale
Planning a Low-Boron HEPA Filter specification?
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