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Luftfilter und chemische Filtration
Low-Boron HEPA Filter
A semiconductor-oriented HEPA panel using ePTFE or specially selected low-boron media and low-outgassing components to reduce airborne ionic contamination near sensitive processes.
- Low-Boron Media Selection
- Low-Outgassing Components
- Semiconductor Cleanroom Use
- Mini-Pleat Panel Design
Produkteinführung
The low-boron HEPA filter is designed for cleanroom zones where conventional borosilicate glass media may contribute trace ionic contaminants. A supported ePTFE membrane or qualified low-boron media is formed into a compact mini-pleat pack and bonded into an anodized-aluminium frame. Low-outgassing separators, polyurethane potting and gasket materials are selected to limit avoidable emissions from the assembled filter. The finished panel fits fan filter units, tool enclosures and recirculation modules serving lithography, wafer processing and other contamination-sensitive operations.
Key Features
Low-outgassing separators and potting compounds support use close to sensitive wafer and optics processes.
An anodized-aluminium frame provides a clean, non-shedding perimeter with stable seal geometry.
Mini-pleat construction supplies a broad active area within the shallow profile used by cleanroom terminals.
Kunden Produktbedenken
Trace ionic and molecular emissions from filter materials can matter when the process operates at semiconductor contamination limits.
Conventional microglass media introduces an avoidable boron source near wafer processing.A supported ePTFE or selected low-boron pack removes the standard borosilicate media from the active filtration layer.
Adhesives and separators release volatile compounds into recirculated cleanroom air.Low-outgassing component choices reduce emissions from materials surrounding the filter pack.
Particles are released from unfinished frame surfaces during installation.Smooth anodized aluminium and sealed corners provide a cleanable, non-shedding perimeter.
A process-tool enclosure has limited space for a deep final filter.The shallow mini-pleat format fits common FFU and equipment-terminal depths.
Typische Anwendungen
Semiconductor wafer fabricationPhotolithography clean baysFlat-panel display productionHard-disk media manufacturingContamination-sensitive tool mini-environments
Technische Parameter
Typical construction ranges for a low-boron semiconductor HEPA panel are shown below.
| Core Material | Supported ePTFE membrane or specially selected low-boron HEPA media |
|---|---|
| Panel Dicke | 66–90 mm overall frame depth |
| Effektive Breite | 305 - 610 mm Nenngesichtbreite |
| Maximale Länge | Bis zu 1220 mm Nennfläche |
| Stahl facing Dicke | 0.4–0.6 mm low-shedding stainless-steel or coated faceguard |
| Kerndichte | Approximately 20–35 kg/m³ equivalent membrane-pack density |
| Thermische Leitfähigkeit | Approximately 0.031–0.041 W/(m·K) for the dry low-boron membrane pack |
| Oberfläche Finish | Natural anodized aluminium with low-outgassing white or stainless protective grid |
| Gemeinsamer Typ | Polyurethane gel channel, closed-cell gasket or extruded knife-edge seal |
| Customisierung | Verfügbar je nach beabsichtigter Anwendung und Betriebsumgebung. |
Verfügbare Optionen
H13 or H14 low-boron mediaGel, gasket or knife-edge sealLow-outgassing cleanroom component setOne-sided or two-sided protective grid
Planning a Low-Boron HEPA Filter specification?
Senden Sie uns Ihre Abmessungen, Installationsbedingungen, Leistungsziele und gewünschte Oberflächenveredelung.
