Three-quarter view of low-boron HEPA filter for semiconductor cleanrooms

Hava filtreleri ve kimyasal filtrasyon

Düşük Boronlu HEPA Filtresi

A semiconductor-oriented HEPA panel using ePTFE or specially selected low-boron media and low-outgassing components to reduce airborne ionic contamination near sensitive processes.

Low-Boron Media Selection
Low-Outgassing Components
Semiconductor Cleanroom Use
Mini-Pleat Panel Design

Alıntı isteği Browse ürünleri

Ürün tanıtımı

The low-boron HEPA filter is designed for cleanroom zones where conventional borosilicate glass media may contribute trace ionic contaminants. A supported ePTFE membrane or qualified low-boron media is formed into a compact mini-pleat pack and bonded into an anodized-aluminium frame. Low-outgassing separators, polyurethane potting and gasket materials are selected to limit avoidable emissions from the assembled filter. The finished panel fits fan filter units, tool enclosures and recirculation modules serving lithography, wafer processing and other contamination-sensitive operations.

Ana Özellikler

ePTFE or selected low-boron media reduces reliance on conventional borosilicate microglass in the active filter pack.

Low-outgassing separators and potting compounds support use close to sensitive wafer and optics processes.

An anodized-aluminium frame provides a clean, non-shedding perimeter with stable seal geometry.

Mini-pleat construction supplies a broad active area within the shallow profile used by cleanroom terminals.

Müşteri Ürün Sorunları

Trace ionic and molecular emissions from filter materials can matter when the process operates at semiconductor contamination limits.

Conventional microglass media introduces an avoidable boron source near wafer processing.A supported ePTFE or selected low-boron pack removes the standard borosilicate media from the active filtration layer.

Adhesives and separators release volatile compounds into recirculated cleanroom air.Low-outgassing component choices reduce emissions from materials surrounding the filter pack.

Particles are released from unfinished frame surfaces during installation.Smooth anodized aluminium and sealed corners provide a cleanable, non-shedding perimeter.

A process-tool enclosure has limited space for a deep final filter.The shallow mini-pleat format fits common FFU and equipment-terminal depths.

Tipik uygulamalar

Semiconductor wafer fabricationPhotolithography clean baysFlat-panel display productionHard-disk media manufacturingContamination-sensitive tool mini-environments

Teknik parametreler

Typical construction ranges for a low-boron semiconductor HEPA panel are shown below.

Temel malzemeler	Supported ePTFE membrane or specially selected low-boron HEPA media
Panel kalınlığı	66–90 mm overall frame depth
Effective Width (Etkili Genişlik)	305–610 mm nominal face width
Maksimum uzunluk	Up to 1220 mm nominal face length
Çelik yüz yüze kalınlığı	0.4–0.6 mm low-shedding stainless-steel or coated faceguard
Core Density (Çekirdek Yoğunluğu)	Approximately 20–35 kg/m³ equivalent membrane-pack density
Termal İletkenlik	Approximately 0.031–0.041 W/(m·K) for the dry low-boron membrane pack
Yüzey bitirme	Natural anodized aluminium with low-outgassing white or stainless protective grid
Ortak tip	Polyurethane gel channel, closed-cell gasket or extruded knife-edge seal
Customization (Özelleşme)	Kullanılan uygulama ve çalışma ortamına göre kullanılabilir.

Mevcut Seçenekler

H13 or H14 low-boron mediaGel, gasket or knife-edge sealLow-outgassing cleanroom component setOne-sided or two-sided protective grid

Planning a Low-Boron HEPA Filter specification?

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