Air Filters and Chemical Filtration

Low-Resistance ULPA Filter

An extended-area U15 mini-pleat filter engineered to reduce pressure loss in high-recirculation cleanrooms while maintaining uniform airflow across the terminal face.

Extended Media Area
Optimized U15 Resistance
Uniform Pleat Channels
High-Recirculation Duty

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Product Introduction

The low-resistance ULPA filter balances U15-class filtration with the fan-energy demands of continuously recirculated semiconductor cleanrooms. A deeper mini-pleat pack provides increased effective area, and calibrated hot-melt separators keep each narrow air channel open at design flow. The pack is bonded into a rigid anodized-aluminium frame and protected by low-obstruction faceguards. Careful pleat density, pack depth and face velocity selection reduce resistance without thinning the filter structure or compromising clean terminal airflow.

Key Features

A deeper extended-area pack lowers the velocity through each square metre of ultra-fine media.

Calibrated separator spacing prevents narrow pleat channels from pinching under operating pressure.

Low-obstruction protective grids shield the pack while preserving an open discharge area.

The rigid aluminium perimeter maintains a flat seal plane in large ceiling and FFU modules.

Customer Product Concerns

Because recirculation fans operate continuously, even a modest unnecessary pressure loss across each ULPA terminal becomes a significant energy penalty.

U15 filters force FFU motors to operate near their upper speed range.Extended media area reduces local velocity and preserves more available fan pressure.

Aggressive pleat spacing creates blocked channels and inconsistent resistance.Controlled hot-melt bead geometry keeps a repeatable clear path between adjacent pleats.

A protective screen blocks too much of the discharge area.A thin open-grid faceguard protects the pack with limited obstruction.

Large ULPA panels bow and lose their perimeter seal.Reinforced aluminium extrusions and bonded corners maintain flatness across the terminal opening.

Typical Applications

High-recirculation semiconductor cleanroomsEnergy-conscious wafer fabrication baysUltra-clean flat-panel display facilitiesPrecision metrology clean spacesLarge fan filter unit arrays

Technical Parameters

Typical construction ranges for an extended-area low-resistance ULPA filter are listed below.

Core Material	Extended-area ultra-fine glass-microfibre or ePTFE ULPA media with optimized mini-pleat separators
Panel Thickness	90–150 mm overall aluminium-frame depth
Effective Width	305–610 mm nominal face width
Maximum Length	Up to 1220 mm nominal face length
Steel Facing Thickness	0.4–0.5 mm low-obstruction coated-steel or stainless faceguard
Core Density	Approximately 28–45 kg/m³ equivalent extended-media-pack density
Thermal Conductivity	Approximately 0.032–0.043 W/(m·K) for the dry ULPA media pack
Surface Finish	Natural anodized aluminium with clean white or stainless open-grid faceguards
Joint Type	Continuous EPDM gasket, polyurethane gel trough or knife-edge perimeter
Customization	Available based on the intended application and operating environment.

Available Options

U15 or U16 filtration classGlass-microfibre or ePTFE media90 mm or 150 mm extended-depth frameGasket, gel or knife-edge terminal seal

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