ESD and Antistatic Products

ESD Shielding Bag

The ESD Shielding Bag is a transparent silver multilayer pouch that combines dissipative surfaces with a metallized barrier for storing and transporting electrostatic-sensitive assemblies.

Metallized shielding layer reduces electrical-field penetration around sensitive assemblies.
Dissipative contact surfaces support safe handling inside a grounded ESD protected area.
Transparent silver film, zipper closure and durable side seals simplify identification and reuse.

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Product Introduction

The bag uses a metal-in laminate with an outer polyester layer, protected aluminum shielding layer and dissipative polyethylene inner surface. The buried metal layer is protected from abrasion while providing a Faraday-cage effect around a properly closed package. A black resealable zipper allows repeated access, and heat-sealed side and bottom seams form a continuous enclosure. The semi-transparent film permits part identification without opening the package.

Key Features

Buried aluminum layer provides electrostatic discharge shielding.

Dissipative interior is suitable for direct contact with protected items.

Dissipative exterior can equalize when handled by grounded personnel.

Transparent silver construction supports visual inventory checks.

Resealable zipper closes the opening for repeated internal transfers.

Wide perimeter seals improve mechanical reliability.

Standard and custom sizes suit boards, modules and subassemblies.

Customer Product Concerns

Protective packaging must manage surface charge, external discharge energy and physical handling without hiding the product or making access impractical.

A low-charging bag alone does not shield its contents from an external discharge.The metallized layer forms a shielding envelope around the closed package.

Exposed metal films can oxidize or abrade.The aluminum layer is buried between protective polymer layers.

Opaque packaging slows part identification.The semi-transparent silver laminate permits visual verification.

Repeated opening damages simple heat-sealed pouches.An integral zipper supports controlled reusable access.

Incorrect sizing leaves excess movement or an incomplete closure.Multiple widths, lengths and closure formats can be matched to the assembly.

Typical Applications

PCB and controller shipment.Semiconductor device storage.Electronic module transfer between facilities.Repair-part and service inventory.Sensitive sensor and instrument packaging.Protected storage outside an ESD workbench area.

Technical Parameters

The representative construction is a 3 mil transparent metal-in laminate. Final film structure and size can be selected around the required shielding, handling and sealing process.

Core Material	Polyester, protected aluminum shielding layer and static-dissipative polyethylene laminate
Panel Thickness	0.076-0.090 mm nominal multilayer film thickness
Effective Width	75-900 mm available internal bag width
Maximum Length	Up to 1500 mm finished bag length
Steel Facing Thickness	Not applicable; 0 mm steel facing and nanometric aluminum shielding layer
Core Density	920-1400 kg/m³ representative density across polymer and metallized layers
Thermal Conductivity	0.2-0.5 W/(m·K) representative laminate through-thickness range
Surface Finish	Semi-transparent silver dissipative film with printed ESD symbol and optional lot code
Joint Type	Heat-welded side and bottom seams with optional resealable zipper or open heat-seal top
Customization	Available based on the intended application and operating environment.

Available Options

Metal-in or application-specific metal-out laminate.Open-top, zipper-top or heat-seal closure.Standard 3 mil or heavier-duty film.Custom width and length.Moisture-barrier laminate.Printed protective symbol and traceability code.Gusseted or flat pouch configuration.

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