Englisch
DeutschCurrent
Arabisch
Französisch
indonesisch
Japanisch
Koreanisch
Malaiisch
Portugiesisch
Russisch
Spanisch
Thailändisch
Türkischer Sprache
Vietnamesisch
ESD und antistatische Produkte
ESD Shielding Tasche
The ESD Shielding Bag is a transparent silver multilayer pouch that combines dissipative surfaces with a metallized barrier for storing and transporting electrostatic-sensitive assemblies.
- Metallized shielding layer reduces electrical-field penetration around sensitive assemblies.
- Dissipative contact surfaces support safe handling inside a grounded ESD protected area.
- Transparent silver film, zipper closure and durable side seals simplify identification and reuse.
Produkteinführung
The bag uses a metal-in laminate with an outer polyester layer, protected aluminum shielding layer and dissipative polyethylene inner surface. The buried metal layer is protected from abrasion while providing a Faraday-cage effect around a properly closed package. A black resealable zipper allows repeated access, and heat-sealed side and bottom seams form a continuous enclosure. The semi-transparent film permits part identification without opening the package.
Key Features
Dissipative interior is suitable for direct contact with protected items.
Dissipative exterior can equalize when handled by grounded personnel.
Transparent silver construction supports visual inventory checks.
Resealable zipper closes the opening for repeated internal transfers.
Wide perimeter seals improve mechanical reliability.
Standard and custom sizes suit boards, modules and subassemblies.
Kunden Produktbedenken
Protective packaging must manage surface charge, external discharge energy and physical handling without hiding the product or making access impractical.
A low-charging bag alone does not shield its contents from an external discharge.The metallized layer forms a shielding envelope around the closed package.
Exposed metal films can oxidize or abrade.The aluminum layer is buried between protective polymer layers.
Opaque packaging slows part identification.The semi-transparent silver laminate permits visual verification.
Repeated opening damages simple heat-sealed pouches.An integral zipper supports controlled reusable access.
Incorrect sizing leaves excess movement or an incomplete closure.Multiple widths, lengths and closure formats can be matched to the assembly.
Typische Anwendungen
PCB and controller shipment.Semiconductor device storage.Electronic module transfer between facilities.Repair-part and service inventory.Sensitive sensor and instrument packaging.Protected storage outside an ESD workbench area.
Technische Parameter
The representative construction is a 3 mil transparent metal-in laminate. Final film structure and size can be selected around the required shielding, handling and sealing process.
| Core Material | Polyester, protected aluminum shielding layer and static-dissipative polyethylene laminate |
|---|---|
| Panel Dicke | 0.076-0.090 mm nominal multilayer film thickness |
| Effektive Breite | 75-900 mm available internal bag width |
| Maximale Länge | Up to 1500 mm finished bag length |
| Stahl facing Dicke | Not applicable; 0 mm steel facing and nanometric aluminum shielding layer |
| Kerndichte | 920-1400 kg/m³ representative density across polymer and metallized layers |
| Thermische Leitfähigkeit | 0.2-0.5 W/(m·K) representative laminate through-thickness range |
| Oberfläche Finish | Semi-transparent silver dissipative film with printed ESD symbol and optional lot code |
| Gemeinsamer Typ | Heat-welded side and bottom seams with optional resealable zipper or open heat-seal top |
| Customisierung | Verfügbar je nach beabsichtigter Anwendung und Betriebsumgebung. |
Verfügbare Optionen
Metal-in or application-specific metal-out laminate.Open-top, zipper-top or heat-seal closure.Standard 3 mil or heavier-duty film.Custom width and length.Moisture-barrier laminate.Printed protective symbol and traceability code.Gusseted or flat pouch configuration.
Planning a ESD Shielding Bag specification?
Senden Sie uns Ihre Abmessungen, Installationsbedingungen, Leistungsziele und gewünschte Oberflächenveredelung.
