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Equipos de sala limpia específicos de la industria
Sistema de limpieza FOUP
An enclosed wash-rinse-dry system that removes contamination from 300 mm FOUP and compatible carrier surfaces before controlled return to production.
- Precision Jet Cleaning
- High-Efficiency Drying
- Enclosed Carrier Handling
- Configurable Automation Interface
Introducción del producto
The FOUP cleaning system integrates carrier loading, controlled opening, precision spray cleaning, rinse management and high-efficiency drying inside a stainless process enclosure. Dedicated chambers separate wet and dry stages to reduce carryover, while filtered air, drainable surfaces and accessible utility panels support repeatable contamination-control operation. Manual and automated handling arrangements can be configured around the fab material-flow strategy.
Características clave
High-efficiency hot-air or air-knife drying reduces residual moisture and water traps.
Separated process zones limit cross-contamination between incoming and cleaned carriers.
Enclosed loading and configurable automation interfaces support controlled FOUP transfer.
Preocupaciones del producto del cliente
Reusable wafer carriers must be cleaned and completely dried without introducing new particles, trapped moisture or handling damage.
Complex FOUP geometry creates inaccessible particle and moisture traps.Multi-directional jet manifolds and staged rinsing reach internal recesses and door features.
Residual water can contaminate the next stored wafer lot.Controlled heated-air and air-knife drying targets hidden surfaces before release.
Manual opening and transfer can cross-contaminate clean and dirty carriers.Separated loading and process chambers define a controlled carrier path.
Cleaning equipment can become a bottleneck in a large FOUP fleet.Parallel chambers and automated recipes increase throughput while maintaining repeatable cycles.
Aplicaciones típicas
300 mm FOUP fleet cleaningFOSB carrier maintenanceSemiconductor contamination-control programsCarrier turnaround between wafer lots
Parámetros técnicos
Typical construction values for an enclosed FOUP wash and dry system are listed below.
| Materiales Core | 304 or 316L stainless steel process enclosure with engineering-polymer FOUP fixtures |
|---|---|
| Panel de espesor | 40-80 mm insulated service and process panels |
| Ancho efectivo | 1800-2600 mm equipment width |
| Longitud máxima | Up to 3500 mm equipment depth |
| Acero frente a espesor | 1.2-2.0 mm stainless steel outer and process-chamber panels |
| Densidad Core | 7850-8000 kg/m³ for stainless process components |
| Conductividad térmica | 14-17 W/(m·K) for stainless process chambers |
| Superficie acabada | Brushed external stainless steel with smooth passivated wet-process surfaces |
| Tipo conjunto | Gasketed process doors with welded drainable chambers and removable utility manifolds |
| Customization | Disponible según la aplicación prevista y el entorno operativo. |
Opciones disponibles
Manual or AMHS-compatible loadingParallel wash and dry chambersFOUP and FOSB fixturesRecipe and host-communication interface
Planning a FOUP Cleaning System specification?
Envíenos sus dimensiones, condiciones de instalación, objetivos de rendimiento y acabado superficial requerido.
