FOUP cleaning system in complete three-quarter view with dual carrier load ports

業界特有のクリーンルーム機器

FOUP 洗浄システム

An enclosed wash-rinse-dry system that removes contamination from 300 mm FOUP and compatible carrier surfaces before controlled return to production.

Precision Jet Cleaning
High-Efficiency Drying
Enclosed Carrier Handling
Configurable Automation Interface

見積もりリクエスト製品案内

商品紹介

The FOUP cleaning system integrates carrier loading, controlled opening, precision spray cleaning, rinse management and high-efficiency drying inside a stainless process enclosure. Dedicated chambers separate wet and dry stages to reduce carryover, while filtered air, drainable surfaces and accessible utility panels support repeatable contamination-control operation. Manual and automated handling arrangements can be configured around the fab material-flow strategy.

主要な特徴

Directed liquid jets reach exterior surfaces, door structures and internal carrier features.

High-efficiency hot-air or air-knife drying reduces residual moisture and water traps.

Separated process zones limit cross-contamination between incoming and cleaned carriers.

Enclosed loading and configurable automation interfaces support controlled FOUP transfer.

お客様の製品に関する懸念事項

Reusable wafer carriers must be cleaned and completely dried without introducing new particles, trapped moisture or handling damage.

Complex FOUP geometry creates inaccessible particle and moisture traps.Multi-directional jet manifolds and staged rinsing reach internal recesses and door features.

Residual water can contaminate the next stored wafer lot.Controlled heated-air and air-knife drying targets hidden surfaces before release.

Manual opening and transfer can cross-contaminate clean and dirty carriers.Separated loading and process chambers define a controlled carrier path.

Cleaning equipment can become a bottleneck in a large FOUP fleet.Parallel chambers and automated recipes increase throughput while maintaining repeatable cycles.

典型的な用途

300 mm FOUP fleet cleaningFOSB carrier maintenanceSemiconductor contamination-control programsCarrier turnaround between wafer lots

技術的なパラメータ

Typical construction values for an enclosed FOUP wash and dry system are listed below.

コア材料	304 or 316L stainless steel process enclosure with engineering-polymer FOUP fixtures
パネルの厚さ	40-80 mm insulated service and process panels
有効幅	1800-2600 mm equipment width
最大長さ	Up to 3500 mm equipment depth
鋼鉄の厚さを直面する	1.2-2.0 mm stainless steel outer and process-chamber panels
コア密度	7850-8000 kg/m³ for stainless process components
熱伝導率	14-17 W/(m·K) for stainless process chambers
表面仕上げ	Brushed external stainless steel with smooth passivated wet-process surfaces
ジョイントタイプ	Gasketed process doors with welded drainable chambers and removable utility manifolds
カスタマイズ	意図したアプリケーションと動作環境に基づいて利用できます。

利用可能なオプション

Manual or AMHS-compatible loadingParallel wash and dry chambersFOUP and FOSB fixturesRecipe and host-communication interface

Planning a FOUP Cleaning System specification?

寸法、設置条件、性能目標、必要な表面仕上げをお送りください。

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