FOUP cleaning system in complete three-quarter view with dual carrier load ports

산업별 클린룸 장비

FOUP 청소 시스템

An enclosed wash-rinse-dry system that removes contamination from 300 mm FOUP and compatible carrier surfaces before controlled return to production.

Precision Jet Cleaning
High-Efficiency Drying
Enclosed Carrier Handling
Configurable Automation Interface

견적 요청 제품 찾아보기

상품 소개

The FOUP cleaning system integrates carrier loading, controlled opening, precision spray cleaning, rinse management and high-efficiency drying inside a stainless process enclosure. Dedicated chambers separate wet and dry stages to reduce carryover, while filtered air, drainable surfaces and accessible utility panels support repeatable contamination-control operation. Manual and automated handling arrangements can be configured around the fab material-flow strategy.

주요 기능

Directed liquid jets reach exterior surfaces, door structures and internal carrier features.

High-efficiency hot-air or air-knife drying reduces residual moisture and water traps.

Separated process zones limit cross-contamination between incoming and cleaned carriers.

Enclosed loading and configurable automation interfaces support controlled FOUP transfer.

고객 제품 관심사

Reusable wafer carriers must be cleaned and completely dried without introducing new particles, trapped moisture or handling damage.

Complex FOUP geometry creates inaccessible particle and moisture traps.Multi-directional jet manifolds and staged rinsing reach internal recesses and door features.

Residual water can contaminate the next stored wafer lot.Controlled heated-air and air-knife drying targets hidden surfaces before release.

Manual opening and transfer can cross-contaminate clean and dirty carriers.Separated loading and process chambers define a controlled carrier path.

Cleaning equipment can become a bottleneck in a large FOUP fleet.Parallel chambers and automated recipes increase throughput while maintaining repeatable cycles.

일반적인 응용 프로그램

300 mm FOUP fleet cleaningFOSB carrier maintenanceSemiconductor contamination-control programsCarrier turnaround between wafer lots

기술 매개변수

Typical construction values for an enclosed FOUP wash and dry system are listed below.

핵심 재료	304 or 316L stainless steel process enclosure with engineering-polymer FOUP fixtures
패널 두께	40-80 mm insulated service and process panels
유효 폭	1800-2600 mm equipment width
최대 길이	Up to 3500 mm equipment depth
강철 면면 두께	1.2-2.0 mm stainless steel outer and process-chamber panels
코어 밀도	7850-8000 kg/m³ for stainless process components
열전도도 (Thermal Conductivity)	14-17 W/(m·K) for stainless process chambers
표면 마무리	Brushed external stainless steel with smooth passivated wet-process surfaces
접합 유형	Gasketed process doors with welded drainable chambers and removable utility manifolds
사용자 정의	의도된 응용 프로그램 및 운영 환경에 따라 사용할 수 있습니다.

사용 가능한 옵션

Manual or AMHS-compatible loadingParallel wash and dry chambersFOUP and FOSB fixturesRecipe and host-communication interface

Planning a FOUP Cleaning System specification?

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