FOUP cleaning system in complete three-quarter view with dual carrier load ports

Peralatan Cleanroom Spesifik Industri

Sistem Pembersihan FOUP

An enclosed wash-rinse-dry system that removes contamination from 300 mm FOUP and compatible carrier surfaces before controlled return to production.

Precision Jet Cleaning
High-Efficiency Drying
Enclosed Carrier Handling
Configurable Automation Interface

Permintaan untuk kutipan Browse Produk

Perkenalan produk

The FOUP cleaning system integrates carrier loading, controlled opening, precision spray cleaning, rinse management and high-efficiency drying inside a stainless process enclosure. Dedicated chambers separate wet and dry stages to reduce carryover, while filtered air, drainable surfaces and accessible utility panels support repeatable contamination-control operation. Manual and automated handling arrangements can be configured around the fab material-flow strategy.

Fitur utama:

Directed liquid jets reach exterior surfaces, door structures and internal carrier features.

High-efficiency hot-air or air-knife drying reduces residual moisture and water traps.

Separated process zones limit cross-contamination between incoming and cleaned carriers.

Enclosed loading and configurable automation interfaces support controlled FOUP transfer.

Kekhawatiran produk pelanggan

Reusable wafer carriers must be cleaned and completely dried without introducing new particles, trapped moisture or handling damage.

Complex FOUP geometry creates inaccessible particle and moisture traps.Multi-directional jet manifolds and staged rinsing reach internal recesses and door features.

Residual water can contaminate the next stored wafer lot.Controlled heated-air and air-knife drying targets hidden surfaces before release.

Manual opening and transfer can cross-contaminate clean and dirty carriers.Separated loading and process chambers define a controlled carrier path.

Cleaning equipment can become a bottleneck in a large FOUP fleet.Parallel chambers and automated recipes increase throughput while maintaining repeatable cycles.

Aplikasi yang Tipis

300 mm FOUP fleet cleaningFOSB carrier maintenanceSemiconductor contamination-control programsCarrier turnaround between wafer lots

Parameter teknis

Typical construction values for an enclosed FOUP wash and dry system are listed below.

Bahan inti	304 or 316L stainless steel process enclosure with engineering-polymer FOUP fixtures
Ketebalan Panel (Panel Thickness)	40-80 mm insulated service and process panels
Efektif lebar	1800-2600 mm equipment width
Panjang maksimum	Up to 3500 mm equipment depth
Baja menghadap ketebalan	1.2-2.0 mm stainless steel outer and process-chamber panels
Kepadatan inti (core density)	7850-8000 kg/m³ for stainless process components
Konduktivitas Termal (Thermal Conductivity)	14-17 W/(m·K) for stainless process chambers
Permukaan selesai	Brushed external stainless steel with smooth passivated wet-process surfaces
Jenis Bersama	Gasketed process doors with welded drainable chambers and removable utility manifolds
Customization (Kustomisasi)	Tersedia berdasarkan aplikasi yang dimaksudkan dan lingkungan operasi.

Pilihan yang tersedia

Manual or AMHS-compatible loadingParallel wash and dry chambersFOUP and FOSB fixturesRecipe and host-communication interface

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