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Vestuário para sala limpa, EPI e consumíveis
Z ESD coberturas de sapatos
Blue polypropylene ESD shoe covers with gathered elastic openings and a long black conductive heel-grounding tape.
- Blue spunbond overshoe with black conductive grounding tape
- Elasticized opening secures common footwear sizes
- Non-marking dissipative path for ESD-controlled floors
Introdução do produto
ESD Shoe Covers add a conductive contact path to a lightweight contamination-control overshoe. The blue spunbond polypropylene cover encloses ordinary footwear, while a long black conductive tape runs beneath the sole and extends from the heel for contact with the wearer as specified by the site ESD procedure. A gathered elastic opening retains the cover during controlled-area movement.
Características-chave
Blue spunbond polypropylene provides lightweight particulate coverage
Long heel tab can be positioned for contact inside the footwear system
Continuous elastic opening accommodates standard shoe profiles
Non-marking construction is intended for controlled production floors
Preocupações do produto do cliente
An ESD overshoe only performs when its conductive tape remains correctly positioned and the floor system provides a verified path. Poor fit or an incorrectly tucked tab can interrupt continuity.
The grounding tape may lose contact with the wearer.Use an extended tape installed according to the approved donning procedure.
The strip can shift away from the sole during walking.Secure the strip through the heel and under the sole without twists.
An oversized cover may bunch and affect stability.Provide standard and extra-large shoe-cover lengths.
Operators may confuse conductive and ordinary overshoes.Specify a clearly visible black conductive strip on a blue cover.
Aplicações típicas
Used in semiconductor, electronics, SMT, battery, precision-instrument and other electrostatic-protected areas with compatible conductive or dissipative floors.
Parâmetros técnicos
These ranges describe disposable ESD overshoes with a conductive heel tape. Performance depends on correct donning and the complete footwear–floor grounding system.
| Material principal | Spunbond polypropylene with polyester/carbon-filament conductive tape |
|---|---|
| Painel de espessura | 0.08–0.15 mm cover material |
| Largura efetiva | 160–180 mm cover height |
| Comprimento máximo | 455 mm shoe cover; 610 mm conductive tape |
| Aço enfrentando espessura | 0 mm; no steel facing used |
| Densidade Core | 30–45 kg/m³ areal-mass equivalent structure |
| Condutividade térmica | 0.04–0.07 W/(m·K), assembly dependent |
| Superfície acabado | Blue low-lint nonwoven with black non-marking conductive tape |
| Tipo conjunto | Serged perimeter seam, elastic opening and sewn-in heel tape |
| Customização | Disponível com base na aplicação pretendida e no ambiente operacional. |
Opções disponíveis
400 mm or 455 mm cover lengthBlue or white polypropylene bodyPlain or slip-resistant soleStandard or extra-large fitAlternative conductive tape lengthClean-packed sealed bags
Planning a ESD Shoe Covers specification?
Envie-nos as suas dimensões, condições de instalação, metas de desempenho e acabamento de superfície necessário.
