Anglais
Allemand
Arabe
FrançaisCurrent
Indonésien
Japonais
Coréen
Le malais
Le portugais
russe
espagnol
Thaïlandais
Le turc
Le vietnamien
Vêtements de salle blanche, EPI et consommables
Couverture de chaussures ESD par
Blue polypropylene ESD shoe covers with gathered elastic openings and a long black conductive heel-grounding tape.
- Blue spunbond overshoe with black conductive grounding tape
- Elasticized opening secures common footwear sizes
- Non-marking dissipative path for ESD-controlled floors
Introduction de produit
ESD Shoe Covers add a conductive contact path to a lightweight contamination-control overshoe. The blue spunbond polypropylene cover encloses ordinary footwear, while a long black conductive tape runs beneath the sole and extends from the heel for contact with the wearer as specified by the site ESD procedure. A gathered elastic opening retains the cover during controlled-area movement.
Key Features
Blue spunbond polypropylene provides lightweight particulate coverage
Long heel tab can be positioned for contact inside the footwear system
Continuous elastic opening accommodates standard shoe profiles
Non-marking construction is intended for controlled production floors
Préoccupations du client produit
An ESD overshoe only performs when its conductive tape remains correctly positioned and the floor system provides a verified path. Poor fit or an incorrectly tucked tab can interrupt continuity.
The grounding tape may lose contact with the wearer.Use an extended tape installed according to the approved donning procedure.
The strip can shift away from the sole during walking.Secure the strip through the heel and under the sole without twists.
An oversized cover may bunch and affect stability.Provide standard and extra-large shoe-cover lengths.
Operators may confuse conductive and ordinary overshoes.Specify a clearly visible black conductive strip on a blue cover.
Les applications typiques
Used in semiconductor, electronics, SMT, battery, precision-instrument and other electrostatic-protected areas with compatible conductive or dissipative floors.
Paramètres techniques
These ranges describe disposable ESD overshoes with a conductive heel tape. Performance depends on correct donning and the complete footwear–floor grounding system.
| Matériaux de base | Spunbond polypropylene with polyester/carbon-filament conductive tape |
|---|---|
| Panneau épaisseur | 0.08–0.15 mm cover material |
| Largeur effective | 160–180 mm cover height |
| Longueur maximale | 455 mm shoe cover; 610 mm conductive tape |
| Acier face épaisseur | 0 mm; no steel facing used |
| Densité Core | 30–45 kg/m³ areal-mass equivalent structure |
| Conductivité thermique | 0.04–0.07 W/(m·K), assembly dependent |
| surface finie | Blue low-lint nonwoven with black non-marking conductive tape |
| Type joint | Serged perimeter seam, elastic opening and sewn-in heel tape |
| Customisation | Disponible en fonction de l'application prévue et de l'environnement d'exploitation. |
Options disponibles
400 mm or 455 mm cover lengthBlue or white polypropylene bodyPlain or slip-resistant soleStandard or extra-large fitAlternative conductive tape lengthClean-packed sealed bags
Planning a ESD Shoe Covers specification?
Envoyez-nous vos dimensions, conditions d'installation, objectifs de performance et finition de surface requise.
