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클린룸 의류, PPE 및 소모품

ESD 신발 덮개

Blue polypropylene ESD shoe covers with gathered elastic openings and a long black conductive heel-grounding tape.
  • Blue spunbond overshoe with black conductive grounding tape
  • Elasticized opening secures common footwear sizes
  • Non-marking dissipative path for ESD-controlled floors
견적 요청 제품 찾아보기

상품 소개

ESD Shoe Covers add a conductive contact path to a lightweight contamination-control overshoe. The blue spunbond polypropylene cover encloses ordinary footwear, while a long black conductive tape runs beneath the sole and extends from the heel for contact with the wearer as specified by the site ESD procedure. A gathered elastic opening retains the cover during controlled-area movement.

주요 기능

Conductive carbon-filament tape supports charge dissipation to a suitable floor

Blue spunbond polypropylene provides lightweight particulate coverage

Long heel tab can be positioned for contact inside the footwear system

Continuous elastic opening accommodates standard shoe profiles

Non-marking construction is intended for controlled production floors

고객 제품 관심사

An ESD overshoe only performs when its conductive tape remains correctly positioned and the floor system provides a verified path. Poor fit or an incorrectly tucked tab can interrupt continuity.

The grounding tape may lose contact with the wearer.Use an extended tape installed according to the approved donning procedure.
The strip can shift away from the sole during walking.Secure the strip through the heel and under the sole without twists.
An oversized cover may bunch and affect stability.Provide standard and extra-large shoe-cover lengths.
Operators may confuse conductive and ordinary overshoes.Specify a clearly visible black conductive strip on a blue cover.

일반적인 응용 프로그램

Used in semiconductor, electronics, SMT, battery, precision-instrument and other electrostatic-protected areas with compatible conductive or dissipative floors.

기술 매개변수

These ranges describe disposable ESD overshoes with a conductive heel tape. Performance depends on correct donning and the complete footwear–floor grounding system.

핵심 재료Spunbond polypropylene with polyester/carbon-filament conductive tape
패널 두께0.08–0.15 mm cover material
유효 폭160–180 mm cover height
최대 길이455 mm shoe cover; 610 mm conductive tape
강철 면면 두께0 mm, 강철 면재 사용 없음
코어 밀도30–45 kg/m³ areal-mass equivalent structure
열전도도 (Thermal Conductivity)0.04–0.07 W/(m·K), assembly dependent
표면 마무리Blue low-lint nonwoven with black non-marking conductive tape
접합 유형Serged perimeter seam, elastic opening and sewn-in heel tape
사용자 정의의도된 응용 프로그램 및 운영 환경에 따라 사용할 수 있습니다.

사용 가능한 옵션

400 mm or 455 mm cover lengthBlue or white polypropylene bodyPlain or slip-resistant soleStandard or extra-large fitAlternative conductive tape lengthClean-packed sealed bags

Planning a ESD Shoe Covers specification?

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