ESD 신발 덮개
- Blue spunbond overshoe with black conductive grounding tape
- Elasticized opening secures common footwear sizes
- Non-marking dissipative path for ESD-controlled floors
상품 소개
ESD Shoe Covers add a conductive contact path to a lightweight contamination-control overshoe. The blue spunbond polypropylene cover encloses ordinary footwear, while a long black conductive tape runs beneath the sole and extends from the heel for contact with the wearer as specified by the site ESD procedure. A gathered elastic opening retains the cover during controlled-area movement.
주요 기능
Blue spunbond polypropylene provides lightweight particulate coverage
Long heel tab can be positioned for contact inside the footwear system
Continuous elastic opening accommodates standard shoe profiles
Non-marking construction is intended for controlled production floors
고객 제품 관심사
An ESD overshoe only performs when its conductive tape remains correctly positioned and the floor system provides a verified path. Poor fit or an incorrectly tucked tab can interrupt continuity.
일반적인 응용 프로그램
기술 매개변수
These ranges describe disposable ESD overshoes with a conductive heel tape. Performance depends on correct donning and the complete footwear–floor grounding system.
| 핵심 재료 | Spunbond polypropylene with polyester/carbon-filament conductive tape |
|---|---|
| 패널 두께 | 0.08–0.15 mm cover material |
| 유효 폭 | 160–180 mm cover height |
| 최대 길이 | 455 mm shoe cover; 610 mm conductive tape |
| 강철 면면 두께 | 0 mm, 강철 면재 사용 없음 |
| 코어 밀도 | 30–45 kg/m³ areal-mass equivalent structure |
| 열전도도 (Thermal Conductivity) | 0.04–0.07 W/(m·K), assembly dependent |
| 표면 마무리 | Blue low-lint nonwoven with black non-marking conductive tape |
| 접합 유형 | Serged perimeter seam, elastic opening and sewn-in heel tape |
| 사용자 정의 | 의도된 응용 프로그램 및 운영 환경에 따라 사용할 수 있습니다. |
사용 가능한 옵션
Planning a ESD Shoe Covers specification?
치수, 설치 조건, 성능 목표 및 필요한 표면 마감을 보내십시오.

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