ESD 靴カバー
- Blue spunbond overshoe with black conductive grounding tape
- Elasticized opening secures common footwear sizes
- Non-marking dissipative path for ESD-controlled floors
商品紹介
ESD Shoe Covers add a conductive contact path to a lightweight contamination-control overshoe. The blue spunbond polypropylene cover encloses ordinary footwear, while a long black conductive tape runs beneath the sole and extends from the heel for contact with the wearer as specified by the site ESD procedure. A gathered elastic opening retains the cover during controlled-area movement.
主要な特徴
Blue spunbond polypropylene provides lightweight particulate coverage
Long heel tab can be positioned for contact inside the footwear system
Continuous elastic opening accommodates standard shoe profiles
Non-marking construction is intended for controlled production floors
お客様の製品に関する懸念事項
An ESD overshoe only performs when its conductive tape remains correctly positioned and the floor system provides a verified path. Poor fit or an incorrectly tucked tab can interrupt continuity.
典型的な用途
技術的なパラメータ
These ranges describe disposable ESD overshoes with a conductive heel tape. Performance depends on correct donning and the complete footwear–floor grounding system.
| コア材料 | Spunbond polypropylene with polyester/carbon-filament conductive tape |
|---|---|
| パネルの厚さ | 0.08–0.15 mm cover material |
| 有効幅 | 160–180 mm cover height |
| 最大長さ | 455 mm shoe cover; 610 mm conductive tape |
| 鋼鉄の厚さを直面する | 0 mm; no steel facing used |
| コア密度 | 30–45 kg/m³ areal-mass equivalent structure |
| 熱伝導率 | 0.04–0.07 W/(m·K), assembly dependent |
| 表面仕上げ | Blue low-lint nonwoven with black non-marking conductive tape |
| ジョイントタイプ | Serged perimeter seam, elastic opening and sewn-in heel tape |
| カスタマイズ | 意図したアプリケーションと動作環境に基づいて利用できます。 |
利用可能なオプション
Planning a ESD Shoe Covers specification?
寸法、設置条件、性能目標、必要な表面仕上げをお送りください。

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