Sistema de Mapeo de Temperatura
- Synchronized multi-point mapping.
- Modular wired sensor inputs.
- Stand-alone touch operation.
Introducción del producto
This compact mapping platform combines a rugged measurement mainframe, a local touch interface and removable thermocouple input modules in one transportable enclosure. Multiple sensors are sampled against a common clock so engineers can compare temperature distribution across a chamber or load throughout the same study. Internal storage preserves the run locally, while network and USB interfaces support study transfer and analysis without tying the instrument to a general-purpose computer during collection.
Características clave
Removable input modules simplify sensor replacement and configuration changes.
Local touch controls support stand-alone study setup and live review.
Cold-junction compensation stabilizes thermocouple measurements at the input bank.
Internal memory safeguards complete mapping records if the network is unavailable.
Battery-backed operation helps a study continue through brief supply interruptions.
Preocupaciones del producto del cliente
Thermal equipment can meet a controller setpoint while still containing local hot or cold zones, so qualification requires simultaneous measurements distributed throughout the usable volume or process load.
Aplicaciones típicas
Parámetros técnicos
Representative portable mapping-system construction is listed below; channel count, thermocouple type and communication accessories can be selected for the intended study.
| Materiales Core | Powder-coated aluminum chassis, polycarbonate control bezel, measurement electronics and removable thermocouple input modules |
|---|---|
| Panel de espesor | Typically 1.5-2.0 mm for aluminum enclosure panels |
| Ancho efectivo | Approximately 300-420 mm across the portable mainframe |
| Longitud máxima | Approximately 350-480 mm including the folded transport-handle profile |
| Acero frente a espesor | Typically 0.8-1.2 mm for internal shielding and module-retaining plates |
| Densidad Core | Approximately 2700 kg/m³ for the aluminum chassis |
| Conductividad térmica | Approximately 167-205 W/(m·K) for the aluminum chassis |
| Superficie acabada | Off-white powder-coated enclosure with dark-navy molded bezel and orange sensor-port identifiers |
| Tipo conjunto | Keyed removable multi-channel input modules with thermocouple terminals plus USB and Ethernet data interfaces |
| Customization | Disponible según la aplicación prevista y el entorno operativo. |
Opciones disponibles
Planning a Temperature Mapping System specification?
Envíenos sus dimensiones, condiciones de instalación, objetivos de rendimiento y acabado superficial requerido.

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