Système de cartographie de température
- Synchronized multi-point mapping.
- Modular wired sensor inputs.
- Stand-alone touch operation.
Introduction de produit
This compact mapping platform combines a rugged measurement mainframe, a local touch interface and removable thermocouple input modules in one transportable enclosure. Multiple sensors are sampled against a common clock so engineers can compare temperature distribution across a chamber or load throughout the same study. Internal storage preserves the run locally, while network and USB interfaces support study transfer and analysis without tying the instrument to a general-purpose computer during collection.
Key Features
Removable input modules simplify sensor replacement and configuration changes.
Local touch controls support stand-alone study setup and live review.
Cold-junction compensation stabilizes thermocouple measurements at the input bank.
Internal memory safeguards complete mapping records if the network is unavailable.
Battery-backed operation helps a study continue through brief supply interruptions.
Préoccupations du client produit
Thermal equipment can meet a controller setpoint while still containing local hot or cold zones, so qualification requires simultaneous measurements distributed throughout the usable volume or process load.
Les applications typiques
Paramètres techniques
Representative portable mapping-system construction is listed below; channel count, thermocouple type and communication accessories can be selected for the intended study.
| Matériaux de base | Powder-coated aluminum chassis, polycarbonate control bezel, measurement electronics and removable thermocouple input modules |
|---|---|
| Panneau épaisseur | Typically 1.5-2.0 mm for aluminum enclosure panels |
| Largeur effective | Approximately 300-420 mm across the portable mainframe |
| Longueur maximale | Approximately 350-480 mm including the folded transport-handle profile |
| Acier face épaisseur | Typically 0.8-1.2 mm for internal shielding and module-retaining plates |
| Densité Core | Approximately 2700 kg/m³ for the aluminum chassis |
| Conductivité thermique | Approximately 167-205 W/(m·K) for the aluminum chassis |
| surface finie | Off-white powder-coated enclosure with dark-navy molded bezel and orange sensor-port identifiers |
| Type joint | Keyed removable multi-channel input modules with thermocouple terminals plus USB and Ethernet data interfaces |
| Customisation | Disponible en fonction de l'application prévue et de l'environnement d'exploitation. |
Options disponibles
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