ESD Cleanroom Garment
- Conductive-grid polyester with panel-to-panel continuity
- Configurable cuff grounding connection
- Low-lint construction for ESD-controlled clean areas
Введение продукции
The ESD Cleanroom Garment is designed to participate in a facility-defined personnel grounding system while limiting particle release. Conductive-grid polyester forms the main shell, with conductive tape or thread linking the cuff, sleeves, yokes, torso and leg panels. A designated grounding stud allows connection to the approved wearer grounding route.
Основные характеристики
Integrated conductive paths connect multiple garment panels
Cuff grounding stud supports a defined bonding connection
Heat-sealed panel edges and pocket-free styling suit controlled areas
Adjustable closures help maintain body and interface coverage
Обеспокоенность клиентов продуктами
Conductive fabric alone does not ensure a safe path to ground. Panel continuity, garment bonding, compatible footwear or cord systems, laundering effects and routine verification all influence actual ESD performance.
Типичные приложения
Технические параметры
The following ranges describe configurable garment construction, not a complete ESD system qualification. Final electrical requirements and test methods must correspond to the facility's approved ESD control plan.
| Основной материал | Continuous-filament polyester with integrated carbon or conductive yarn grid |
|---|---|
| Толщина панели | 0.22–0.50 mm |
| эффективная ширина | 520–790 mm per laid-flat garment section |
| Максимальная длина | 2050 mm |
| Толщина линий стали | 0 mm; stainless steel may be used only for grounding studs and adjusters |
| Плотность ядра | 80–155 kg/m³ apparent fabric bulk density |
| Теплопроводимость | 0.035–0.060 W/(m·K), material dependent |
| Поверхностная отделка | Smooth low-lint grid weave with heat-sealed panel edges |
| Объединенный тип | Conductive sewn seams or integrated tape linking panels to a grounding stud |
| Customization | Доступно в зависимости от предполагаемого применения и операционной среды. |
Доступные варианты
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