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ESD e produtos antiestáticos
ESD fita
ESD Tape is an amber low-charging process tape for temporary masking, identification, bundling and protected packaging tasks around electronic assemblies.
- Low-charging amber film is suited to controlled electronics handling and temporary process masking.
- Clean adhesive provides reliable hold with controlled removal from compatible surfaces.
- Repeating ESD protective symbols make static-control use immediately recognizable.
Introdução do produto
The tape combines a thin amber polymer backing with a pressure-sensitive adhesive and a rigid paperboard core. Its low-charging construction helps limit triboelectric generation during unwind compared with ordinary high-charging tape. Repeating protective symbols identify its controlled-use purpose. The roll can be supplied in several widths for PCB masking, connector protection, component identification or closure of compatible ESD packaging.
Características-chave
Amber transparent film allows the covered area to remain visible.
Pressure-sensitive adhesive bonds without heat activation.
Printed ESD symbols support process identification and auditing.
Consistent roll winding enables clean dispenser feeding.
Thin backing conforms around edges and small assemblies.
Adhesive, backing and width can be selected for the process temperature.
Preocupações do produto do cliente
Tape selection affects charge generation, adhesive residue, temperature exposure and the visibility of process controls.
Fast unwind from ordinary tape can create high electrostatic charge.The low-charging backing is designed for controlled electronics-process use.
Adhesive residue contaminates contacts and finished surfaces.Compatible clean-removal adhesive can be selected for the substrate and dwell time.
Operators cannot distinguish process tape from office tape.Repeating ESD protective symbols provide visible identification.
One tape cannot cover both room-temperature and high-temperature processes.Backing and adhesive systems are selected around the operating temperature.
Poor roll storage changes unwind and adhesion.Flat, dry, temperature-controlled storage and date rotation preserve handling consistency.
Aplicações típicas
Temporary PCB and connector masking.ESD package closure inside controlled processes.Component and fixture identification.Cable and small-part bundling.Electronics assembly process marking.Groundable dispenser use at ESD benches.
Parâmetros técnicos
The listed construction represents an amber electronics process tape. Backing chemistry and adhesive must be selected around temperature, residue and charge-generation requirements.
| Material principal | Low-charging amber polymer film with pressure-sensitive acrylic or silicone adhesive and paperboard roll core |
|---|---|
| Painel de espessura | 0.045-0.080 mm total tape thickness |
| Largura efetiva | 6-50 mm standard slit width |
| Comprimento máximo | Up to 66000 mm per roll |
| Aço enfrentando espessura | Not applicable; 0 mm steel facing |
| Densidade Core | 1200-1450 kg/m³ representative backing-film density |
| Condutividade térmica | 0.12-0.25 W/(m·K) representative polymer-backing range |
| Superfície acabado | Gloss amber transparent backing with repeating black ESD protective symbols |
| Tipo conjunto | Pressure-sensitive adhesive bond supplied on a rigid spiral-wound core |
| Customização | Disponível com base na aplicação pretendida e no ambiente operacional. |
Opções disponíveis
Amber polyimide, clear cellulose or conductive-grid construction.Acrylic or silicone pressure-sensitive adhesive.Printed or unprinted backing.Multiple roll widths and lengths.High-temperature masking grade.Low-residue clean-removal grade.Groundable ESD tape dispenser.
Planning a ESD Tape specification?
Envie-nos as suas dimensões, condições de instalação, metas de desempenho e acabamento de superfície necessário.
