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Produk ESD dan Antistatik

ESD Tape (Tape ESD)

ESD Tape is an amber low-charging process tape for temporary masking, identification, bundling and protected packaging tasks around electronic assemblies.
  • Low-charging amber film is suited to controlled electronics handling and temporary process masking.
  • Clean adhesive provides reliable hold with controlled removal from compatible surfaces.
  • Repeating ESD protective symbols make static-control use immediately recognizable.
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Perkenalan produk

The tape combines a thin amber polymer backing with a pressure-sensitive adhesive and a rigid paperboard core. Its low-charging construction helps limit triboelectric generation during unwind compared with ordinary high-charging tape. Repeating protective symbols identify its controlled-use purpose. The roll can be supplied in several widths for PCB masking, connector protection, component identification or closure of compatible ESD packaging.

Fitur utama:

Low-charging backing reduces electrostatic generation during unwind.

Amber transparent film allows the covered area to remain visible.

Pressure-sensitive adhesive bonds without heat activation.

Printed ESD symbols support process identification and auditing.

Consistent roll winding enables clean dispenser feeding.

Thin backing conforms around edges and small assemblies.

Adhesive, backing and width can be selected for the process temperature.

Kekhawatiran produk pelanggan

Tape selection affects charge generation, adhesive residue, temperature exposure and the visibility of process controls.

Fast unwind from ordinary tape can create high electrostatic charge.The low-charging backing is designed for controlled electronics-process use.
Adhesive residue contaminates contacts and finished surfaces.Compatible clean-removal adhesive can be selected for the substrate and dwell time.
Operators cannot distinguish process tape from office tape.Repeating ESD protective symbols provide visible identification.
One tape cannot cover both room-temperature and high-temperature processes.Backing and adhesive systems are selected around the operating temperature.
Poor roll storage changes unwind and adhesion.Flat, dry, temperature-controlled storage and date rotation preserve handling consistency.

Aplikasi yang Tipis

Temporary PCB and connector masking.ESD package closure inside controlled processes.Component and fixture identification.Cable and small-part bundling.Electronics assembly process marking.Groundable dispenser use at ESD benches.

Parameter teknis

The listed construction represents an amber electronics process tape. Backing chemistry and adhesive must be selected around temperature, residue and charge-generation requirements.

Bahan intiLow-charging amber polymer film with pressure-sensitive acrylic or silicone adhesive and paperboard roll core
Ketebalan Panel (Panel Thickness)0.045-0.080 mm total tape thickness
Efektif lebar6-50 mm standard slit width
Panjang maksimumUp to 66000 mm per roll
Baja menghadap ketebalanNot applicable; 0 mm steel facing
Kepadatan inti (core density)1200-1450 kg/m³ representative backing-film density
Konduktivitas Termal (Thermal Conductivity)0.12-0.25 W/(m·K) representative polymer-backing range
Permukaan selesaiGloss amber transparent backing with repeating black ESD protective symbols
Jenis BersamaPressure-sensitive adhesive bond supplied on a rigid spiral-wound core
Customization (Kustomisasi)Tersedia berdasarkan aplikasi yang dimaksudkan dan lingkungan operasi.

Pilihan yang tersedia

Amber polyimide, clear cellulose or conductive-grid construction.Acrylic or silicone pressure-sensitive adhesive.Printed or unprinted backing.Multiple roll widths and lengths.High-temperature masking grade.Low-residue clean-removal grade.Groundable ESD tape dispenser.

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