Проводящий пол
- Through-body conductive vinyl maintains function beyond the surface layer.
- Conductive adhesive and copper strips create a planned route to earth.
- Tile or sheet formats provide a smooth cleanable finish for controlled interiors.
Введение продукции
Conductive Flooring is a compact homogeneous vinyl covering with electrically active material distributed through its thickness. It is available as precision-cut tiles or sheet material for installation over a prepared substrate. Conductive adhesive couples the covering to copper strips connected to the building's designated grounding system. Heat-welded sheet seams or accurately fitted tile joints create a smooth surface suited to sensitive electronics, laboratories and controlled manufacturing areas.
Основные характеристики
Conductive adhesive and copper-strip network create a planned route to ground.
Dense, low-glare surface supports routine cleaning and decontamination.
Tile and sheet formats allow different room geometries and repair strategies.
Low residual indentation supports rolling chairs and light equipment traffic.
Neutral speckled colors help conceal minor service marks without decorative clutter.
Обеспокоенность клиентов продуктами
Conductive flooring performs as an installed electrical system, so substrate preparation, adhesive coverage, copper-strip continuity, joint execution and maintenance must be coordinated rather than evaluated separately.
Типичные приложения
Технические параметры
The specifications below reflect common homogeneous conductive vinyl systems. Format, joint treatment, adhesive and copper-strip layout are finalized together for the substrate, room geometry and grounding design.
| Основной материал | Homogeneous electrically conductive polyvinyl chloride with carbon-based conductive components |
|---|---|
| Толщина панели | 2.0 mm |
| эффективная ширина | 610 mm tile width or 2000 mm sheet width |
| Максимальная длина | Up to 23000 mm sheet roll length |
| Толщина линий стали | 0.1 mm nominal copper grounding-strip thickness |
| Плотность ядра | 1450–1550 kg/m³ |
| Теплопроводимость | 0.20–0.25 W/(m·K) |
| Поверхностная отделка | Matte low-glare homogeneous vinyl with fine non-directional chip pattern |
| Объединенный тип | Butt-jointed tiles or heat-welded sheet seams over conductive adhesive and copper strips |
| Customization | Доступно в зависимости от предполагаемого применения и операционной среды. |
Доступные варианты
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