Plancher conducteur
- Through-body conductive vinyl maintains function beyond the surface layer.
- Conductive adhesive and copper strips create a planned route to earth.
- Tile or sheet formats provide a smooth cleanable finish for controlled interiors.
Introduction de produit
Conductive Flooring is a compact homogeneous vinyl covering with electrically active material distributed through its thickness. It is available as precision-cut tiles or sheet material for installation over a prepared substrate. Conductive adhesive couples the covering to copper strips connected to the building's designated grounding system. Heat-welded sheet seams or accurately fitted tile joints create a smooth surface suited to sensitive electronics, laboratories and controlled manufacturing areas.
Key Features
Conductive adhesive and copper-strip network create a planned route to ground.
Dense, low-glare surface supports routine cleaning and decontamination.
Tile and sheet formats allow different room geometries and repair strategies.
Low residual indentation supports rolling chairs and light equipment traffic.
Neutral speckled colors help conceal minor service marks without decorative clutter.
Préoccupations du client produit
Conductive flooring performs as an installed electrical system, so substrate preparation, adhesive coverage, copper-strip continuity, joint execution and maintenance must be coordinated rather than evaluated separately.
Les applications typiques
Paramètres techniques
The specifications below reflect common homogeneous conductive vinyl systems. Format, joint treatment, adhesive and copper-strip layout are finalized together for the substrate, room geometry and grounding design.
| Matériaux de base | Homogeneous electrically conductive polyvinyl chloride with carbon-based conductive components |
|---|---|
| Panneau épaisseur | 2.0 mm |
| Largeur effective | 610 mm tile width or 2000 mm sheet width |
| Longueur maximale | Up to 23000 mm sheet roll length |
| Acier face épaisseur | 0.1 mm nominal copper grounding-strip thickness |
| Densité Core | 1450–1550 kg/m³ |
| Conductivité thermique | 0.20–0.25 W/(m·K) |
| surface finie | Matte low-glare homogeneous vinyl with fine non-directional chip pattern |
| Type joint | Butt-jointed tiles or heat-welded sheet seams over conductive adhesive and copper strips |
| Customisation | Disponible en fonction de l'application prévue et de l'environnement d'exploitation. |
Options disponibles
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