FOUP Transport Cart
- Three-point locator sets position each 300 mm FOUP consistently on the shelf
- Static-dissipative mats and grounding options support charge-controlled handling
- Raised three-sided ledges keep carriers inside the cart footprint during movement
Perkenalan produk
The FOUP transport cart provides dedicated manual mobility for closed 300 mm wafer carriers between semiconductor process and storage points. Each solid stainless shelf holds a replaceable static-dissipative mat and a three-pin locator pattern aligned to the carrier base. Three raised shelf edges protect the load envelope, while the open front supports direct placement and retrieval. The welded frame, integrated handle and conductive rolling hardware are selected for controlled cleanroom movement.
Fitur utama:
Three locator pins on each shelf establish repeatable carrier orientation.
Dark ESD mats cushion the base and provide a controlled contact surface.
Raised rear and side ledges resist carrier migration without obstructing front loading.
Conductive casters and a grounding chain provide configurable charge-dissipation paths.
Kekhawatiran produk pelanggan
Generic carts do not positively locate FOUP bases, allow carriers to shift during turns and may accumulate charge beneath sensitive wafer enclosures.
Aplikasi yang Tipis
Parameter teknis
Locator-pin coordinates must match the target FOUP bottom interface so the carrier rests on its intended support features rather than on the shell. Shelf stiffness, mat thickness and ledge clearance are chosen around loaded mass and operator access. The stainless frame transfers shelf loads to four corner casters; grounding continuity between shelves, frame and rolling hardware is verified for the supplied configuration.
| Bahan inti | 304 or 316L stainless steel frame with static-dissipative polymer shelf mats |
|---|---|
| Ketebalan Panel (Panel Thickness) | 1.2–2.0 mm solid stainless shelf pans |
| Efektif lebar | 420–650 mm usable shelf width |
| Panjang maksimum | Up to 900 mm overall cart length |
| Baja menghadap ketebalan | 1.2–2.0 mm exposed stainless shelf surfaces |
| Kepadatan inti (core density) | 7900–8000 kg/m³ nominal stainless steel density |
| Konduktivitas Termal (Thermal Conductivity) | Sekitar 14,6 - 16,2 W / (m · K) pada suhu kamar |
| Permukaan selesai | Fine-brushed or electropolished stainless steel with removable textured ESD mats |
| Jenis Bersama | Continuously welded square-tube frame with retained solid shelves, three-point locator sets and swivel casters |
| Customization (Kustomisasi) | Tersedia berdasarkan aplikasi yang dimaksudkan dan lingkungan operasi. |
Pilihan yang tersedia
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