esd-table-mat-main-three-quarter.jpg` — `Blue two-layer ESD table mat with black conductive backing and grounding cord

ESD и антистатические продукты

ESD Столовая матка

A two-layer ESD table mat combines a static-dissipative work surface with a conductive backing and groundable snap for controlled handling of sensitive electronic assemblies.

Dissipative working surface bonded to a conductive backing layer.
Fitted snap connects the mat to a compatible workstation common-point ground.
Flexible rubber format supports finished bench sizes and cut-to-length layouts.

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Введение продукции

The ESD Table Mat uses a durable blue dissipative top layer bonded to a black conductive underside. The top provides a controlled working surface for components, while the lower layer helps distribute the ground path across the mat. A fitted snap accepts a compatible ground cord for connection to the workstation common point. Rubber construction is suited to soldering and routine electronics work, with cut sizes available for different bench layouts.

Основные характеристики

Dual-layer construction separates the dissipative contact surface from the conductive backing.

Grounding snap supports a secure connection to the workstation common-point ground.

Fine-textured surface provides component stability without printed grids or raised obstructions.

Rubber options resist soldering heat and many common workshop chemicals.

Flexible sheet can be supplied as finished mats or cut from roll stock.

Blue top and black underside provide immediate visual layer identification.

Обеспокоенность клиентов продуктами

A reliable grounded worksurface depends on the mat layers, snap hardware, ground cord, common-point connection and cleaning practice working together throughout daily handling operations.

Challenges IntroductionA reliable grounded worksurface depends on the mat layers, snap hardware, ground cord, common-point connection and cleaning practice working together throughout daily handling operations.

Charge remains on a standard bench surfaceThe grounded dissipative layer provides a controlled path for charge removal from conductors placed on the mat.

Uneven grounding across the matThe conductive backing distributes electrical contact beneath the work surface toward the fitted grounding point.

Mat damage during soldering workHeat-resistant rubber construction is available for benches exposed to solder splash and common process chemicals.

Ground cords disconnect during useMatched snap hardware creates a positive detachable connection and allows damaged cords to be replaced independently.

Standard sizes do not fit the workstationWidths, lengths, corner shapes and snap positions can be selected around the actual bench layout.

Типичные приложения

PCB assembly and soldering benches.Electronics inspection and rework stations.Component test and repair surfaces.ESD protected packing and kitting tables.Shelf or trolley liners for sensitive devices.

Технические параметры

The values below represent common dual-layer rubber worksurface mats. Finished dimensions, layer construction, snap position and ground cord are selected to suit the bench and its common-point grounding arrangement.

Основной материал	Two-layer synthetic nitrile rubber with dissipative top and conductive bottom
Толщина панели	1.5–2.0 mm
эффективная ширина	600–1200 mm
Максимальная длина	Up to 15000 mm roll length
Толщина линий стали	0.5 mm stainless-steel grounding snap hardware
Плотность ядра	1300–1500 kg/m³
Теплопроводимость	0.20–0.30 W/(m·K)
Поверхностная отделка	Fine-textured blue dissipative top with smooth black conductive backing
Объединенный тип	Bonded dual-layer sheet with fitted grounding snap and detachable cord connection
Customization	Доступно в зависимости от предполагаемого применения и операционной среды.

Доступные варианты

Blue, gray or green dissipative top colors.Finished sheets or roll material.Alternative widths, lengths and corner radii.10 mm snap type and snap location.Straight or coiled grounding cords.Rubber or vinyl constructions for different process conditions.

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