esd-table-mat-main-three-quarter.jpg` — `Blue two-layer ESD table mat with black conductive backing and grounding cord

Produk ESD dan Antistatik

Mat Jadual ESD

A two-layer ESD table mat combines a static-dissipative work surface with a conductive backing and groundable snap for controlled handling of sensitive electronic assemblies.

Dissipative working surface bonded to a conductive backing layer.
Fitted snap connects the mat to a compatible workstation common-point ground.
Flexible rubber format supports finished bench sizes and cut-to-length layouts.

Permintaan sebut harga Semak imbas produk

Pengenalan Produk

The ESD Table Mat uses a durable blue dissipative top layer bonded to a black conductive underside. The top provides a controlled working surface for components, while the lower layer helps distribute the ground path across the mat. A fitted snap accepts a compatible ground cord for connection to the workstation common point. Rubber construction is suited to soldering and routine electronics work, with cut sizes available for different bench layouts.

Ciri-ciri Utama

Dual-layer construction separates the dissipative contact surface from the conductive backing.

Grounding snap supports a secure connection to the workstation common-point ground.

Fine-textured surface provides component stability without printed grids or raised obstructions.

Rubber options resist soldering heat and many common workshop chemicals.

Flexible sheet can be supplied as finished mats or cut from roll stock.

Blue top and black underside provide immediate visual layer identification.

Kebimbangan Produk Pelanggan

A reliable grounded worksurface depends on the mat layers, snap hardware, ground cord, common-point connection and cleaning practice working together throughout daily handling operations.

Challenges IntroductionA reliable grounded worksurface depends on the mat layers, snap hardware, ground cord, common-point connection and cleaning practice working together throughout daily handling operations.

Charge remains on a standard bench surfaceThe grounded dissipative layer provides a controlled path for charge removal from conductors placed on the mat.

Uneven grounding across the matThe conductive backing distributes electrical contact beneath the work surface toward the fitted grounding point.

Mat damage during soldering workHeat-resistant rubber construction is available for benches exposed to solder splash and common process chemicals.

Ground cords disconnect during useMatched snap hardware creates a positive detachable connection and allows damaged cords to be replaced independently.

Standard sizes do not fit the workstationWidths, lengths, corner shapes and snap positions can be selected around the actual bench layout.

Permohonan yang biasa

PCB assembly and soldering benches.Electronics inspection and rework stations.Component test and repair surfaces.ESD protected packing and kitting tables.Shelf or trolley liners for sensitive devices.

Parameter teknikal

The values below represent common dual-layer rubber worksurface mats. Finished dimensions, layer construction, snap position and ground cord are selected to suit the bench and its common-point grounding arrangement.

Bahan Teras	Two-layer synthetic nitrile rubber with dissipative top and conductive bottom
Ketebalan Panel	1.5-2.0 mm
Lebar berkesan	600–1200 mm
Panjang maksimum	Up to 15000 mm roll length
Keluli Menghadapi Ketebalan	0.5 mm stainless-steel grounding snap hardware
Ketumpatan teras	1300–1500 kg/m³
Kekonduksian Terma	0.20–0.30 W/(m·K)
Kemasan permukaan	Fine-textured blue dissipative top with smooth black conductive backing
Jenis Bersatu	Bonded dual-layer sheet with fitted grounding snap and detachable cord connection
Penyesuaian	Boleh didapati berdasarkan aplikasi yang dimaksudkan dan persekitaran operasi.

Pilihan yang boleh didapati

Blue, gray or green dissipative top colors.Finished sheets or roll material.Alternative widths, lengths and corner radii.10 mm snap type and snap location.Straight or coiled grounding cords.Rubber or vinyl constructions for different process conditions.

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