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Filter udara dan filtrasi kimia

Filter AMC untuk Cleanroom Semikonduktor

A low-outgassing pleated molecular panel formulated to control airborne acids, bases, VOCs or selected dopants in semiconductor cleanrooms and process equipment.
  • Semiconductor AMC Control
  • Low-Outgassing Components
  • Targeted Pleated Adsorbents
  • FFU-Compatible Panel
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Perkenalan produk

The AMC filter for semiconductor cleanrooms embeds activated carbon, ion-exchange resin or chemically modified adsorbent within a clean pleated support. The resulting panel provides substantially more active area than a flat granular screen while keeping the shallow depth required by fan filter units, return-air modules and process tools. Different media layers can target volatile organics, acids, bases or selected dopant compounds. Low-outgassing frame, separator, gasket and potting materials help the finished filter operate near contamination-sensitive wafer, display and storage processes.

Fitur utama:

Pleated embedded adsorbent provides a high active area within the shallow envelope of a cleanroom terminal panel.

Media chemistry can be selected for VOC, acid, base or dopant contamination rather than using one universal carbon grade.

Low-outgassing support and frame materials reduce the filter assembly's own contribution to the clean environment.

Clean retaining layers limit adsorbent particle shedding toward downstream HEPA or ULPA media.

Kekhawatiran produk pelanggan

Molecular contamination can alter wafer surfaces or corrode process hardware even when the cleanroom already meets its particulate classification.

Particle filters do not remove airborne acids, bases or volatile organic molecules.Embedded molecular adsorbents capture or react with the selected gas family before it reaches the process.
One broad-spectrum carbon grade cannot address multiple semiconductor AMC groups equally.Separate acid, base, VOC and dopant media layers can be arranged for the identified contaminant profile.
Loose chemical pellets shed dust toward a downstream ULPA terminal.Pleated embedded media and clean support scrims contain the adsorbent within the panel structure.
A deep chemical bed will not fit an FFU or process-tool return module.The high-area pleated panel provides a compact AMC stage in standard shallow cleanroom dimensions.

Aplikasi yang Tipis

Semiconductor wafer cleanroomsLithography and coating process toolsFlat-panel and OLED manufacturingChemical-sensitive storage cabinetsFFU and recirculation-air AMC stages

Parameter teknis

Typical construction ranges for a low-outgassing semiconductor AMC panel are listed below.

Bahan intiPleated activated-carbon, ion-exchange or chemically impregnated adsorbent embedded in a low-outgassing support
Ketebalan Panel (Panel Thickness)25–100 mm overall cleanroom-panel depth
Efektif lebar305–610 mm nominal face width
Panjang maksimumUp to 1220 mm nominal face length
Baja menghadap ketebalan0.4–0.6 mm low-shedding stainless or coated retaining grid when specified
Kepadatan inti (core density)Approximately 60–180 kg/m³ equivalent embedded-adsorbent media density
Konduktivitas Termal (Thermal Conductivity)Approximately 0.040–0.090 W/(m·K) for the dry pleated adsorbent composite
Permukaan selesaiNatural anodized aluminium or clean low-outgassing polymer frame
Jenis BersamaFlat gasket, gel-compatible perimeter or clip-in FFU cassette connection
Customization (Kustomisasi)Tersedia berdasarkan aplikasi yang dimaksudkan dan lingkungan operasi.

Pilihan yang tersedia

VOC-targeted activated carbonAcid-gas chemisorption mediaAmmonia and amine ion-exchange mediaSingle-layer or multi-layer AMC cassette

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