상품 소개
The FOUP storage cabinet provides an organized buffer between semiconductor process tools and material-handling operations. Each storage position includes stable pod supports, controlled clearance and optional nitrogen purge coupling so a 300 mm FOUP can remain protected while waiting for its next step. Open-front access supports manual or automated transfer configurations, while local status indicators help operators identify occupied and available positions.
주요 기능
Optional nitrogen interfaces reduce oxygen and moisture exposure inside compatible stored pods.
Local occupancy indicators make available positions visible from the aisle.
Modular bay construction scales from compact manual buffers to larger stocker arrangements.
고객 제품 관심사
FOUP buffers must keep pods organized, correctly located and ready for safe transfer without consuming unnecessary cleanroom floor space.
FOUPs placed on general shelving can be misaligned or damaged during retrieval.Dedicated locating supports constrain each pod at a repeatable storage and pickup position.
Long queue times increase the risk of moisture and oxygen entering stored carriers.Optional position-level nitrogen couplings purge compatible FOUPs during storage.
Operators lose time searching for an empty or released location.Occupancy and status indicators identify available positions directly at the cabinet.
A fixed buffer cannot adapt when tool throughput changes.Modular vertical and horizontal bays allow storage capacity to follow the process layout.
일반적인 응용 프로그램
300 mm wafer fab bufferingProcess-tool interface storageMetrology queue managementSemiconductor material-handling areas
기술 매개변수
Typical construction values for a modular FOUP storage cabinet are shown below.
| 핵심 재료 | Anodized aluminum frame with 304 stainless steel supports and engineering-polymer FOUP locating pads |
|---|---|
| 패널 두께 | 1.5-3.0 mm service and divider panels |
| 유효 폭 | 600-2400 mm cabinet width depending on bay count |
| 최대 길이 | Up to 3000 mm modular stocker length |
| 강철 면면 두께 | 1.2-2.0 mm stainless steel support and service panels |
| 코어 밀도 | 2700 kg/m³ for aluminum framing and 7850-8000 kg/m³ for stainless supports |
| 열전도도 (Thermal Conductivity) | 14-17 W/(m·K) for stainless support components |
| 표면 마무리 | Natural anodized aluminum with brushed stainless steel and black polymer locating surfaces |
| 접합 유형 | Bolted modular frame with indexed FOUP shelves, kinematic stops and optional purge couplings |
| 사용자 정의 | 의도된 응용 프로그램 및 운영 환경에 따라 사용할 수 있습니다. |
사용 가능한 옵션
Nitrogen purge at each positionManual or automated transfer interfaceOccupancy sensingCustom bay and tier count
Planning a FOUP Storage Cabinet specification?
치수, 설치 조건, 성능 목표 및 필요한 표면 마감을 보내십시오.

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