ESD Shelving (Rak ESD)
- Groundable steel frame bonds all conductive levels into one controlled storage structure.
- Adjustable shelves accommodate totes, trays and component bins of different heights.
- Dissipative shelf liners protect sensitive packages from direct contact with bare metal.
Perkenalan produk
The system combines powder-coated steel uprights with adjustable steel shelf panels and static-dissipative liners. Metal-to-metal hardware maintains continuity between structural members, while a clearly identified ground lead bonds the rack to the facility ESD grounding network. Perimeter shelf lips retain containers without creating inaccessible cavities. Level spacing, bay width and reinforcement can be selected around the stored load and material-flow plan.
Fitur utama:
Adjustable shelf positions suit changing container and carton sizes.
Dissipative liners provide a controlled contact surface for ESDS packaging.
Dedicated ground lug gives a visible, serviceable connection point.
Light-gray semiconductive powder coat supports visual cleanliness inspection.
Bolted modular construction permits bay extension and replacement of individual parts.
Level lips and optional dividers improve stock retention and organization.
Kekhawatiran produk pelanggan
Storage racks must carry practical loads while ensuring conductive structures and contact surfaces remain at a controlled potential.
Aplikasi yang Tipis
Parameter teknis
The representative specification describes a five-level freestanding rack. Bay dimensions, shelf load, liner material, resistance, bracing and grounding accessories are chosen for the storage environment.
| Bahan inti | Powder-coated carbon-steel uprights, braces and formed steel shelf panels |
|---|---|
| Ketebalan Panel (Panel Thickness) | 0.8–2.0 mm formed shelf and upright material thickness |
| Efektif lebar | 600–1500 mm clear shelf width per bay |
| Panjang maksimum | Up to 2400 mm overall rack height |
| Baja menghadap ketebalan | 0.8–1.5 mm exposed formed-steel shelf thickness |
| Kepadatan inti (core density) | Approximately 7850 kg/m³ carbon-steel density |
| Konduktivitas Termal (Thermal Conductivity) | 45–60 W/(m·K) for the steel structure |
| Permukaan selesai | Light-gray semiconductive powder coat with removable dark dissipative shelf liners |
| Jenis Bersama | Bolted modular frame with adjustable shelf clips and dedicated ground lug |
| Customization (Kustomisasi) | Tersedia berdasarkan aplikasi yang dimaksudkan dan lingkungan operasi. |
Pilihan yang tersedia
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