ESD-Schale
- Groundable steel frame bonds all conductive levels into one controlled storage structure.
- Adjustable shelves accommodate totes, trays and component bins of different heights.
- Dissipative shelf liners protect sensitive packages from direct contact with bare metal.
Produkteinführung
The system combines powder-coated steel uprights with adjustable steel shelf panels and static-dissipative liners. Metal-to-metal hardware maintains continuity between structural members, while a clearly identified ground lead bonds the rack to the facility ESD grounding network. Perimeter shelf lips retain containers without creating inaccessible cavities. Level spacing, bay width and reinforcement can be selected around the stored load and material-flow plan.
Key Features
Adjustable shelf positions suit changing container and carton sizes.
Dissipative liners provide a controlled contact surface for ESDS packaging.
Dedicated ground lug gives a visible, serviceable connection point.
Light-gray semiconductive powder coat supports visual cleanliness inspection.
Bolted modular construction permits bay extension and replacement of individual parts.
Level lips and optional dividers improve stock retention and organization.
Kunden Produktbedenken
Storage racks must carry practical loads while ensuring conductive structures and contact surfaces remain at a controlled potential.
Typische Anwendungen
Technische Parameter
The representative specification describes a five-level freestanding rack. Bay dimensions, shelf load, liner material, resistance, bracing and grounding accessories are chosen for the storage environment.
| Core Material | Powder-coated carbon-steel uprights, braces and formed steel shelf panels |
|---|---|
| Panel Dicke | 0.8–2.0 mm formed shelf and upright material thickness |
| Effektive Breite | 600–1500 mm clear shelf width per bay |
| Maximale Länge | Up to 2400 mm overall rack height |
| Stahl facing Dicke | 0.8–1.5 mm exposed formed-steel shelf thickness |
| Kerndichte | Approximately 7850 kg/m³ carbon-steel density |
| Thermische Leitfähigkeit | 45–60 W/(m·K) for the steel structure |
| Oberfläche Finish | Light-gray semiconductive powder coat with removable dark dissipative shelf liners |
| Gemeinsamer Typ | Bolted modular frame with adjustable shelf clips and dedicated ground lug |
| Customisierung | Verfügbar je nach beabsichtigter Anwendung und Betriebsumgebung. |
Verfügbare Optionen
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