Green solvent-free high-build epoxy flooring sample in three-quarter view

클린룸 바닥 시스템

Solvent - Free High - Build 에폭시 바닥재

A high-solids epoxy floor system formulated without added solvent for dense coverage, low application odor and seamless concrete protection.

Solvent-Free Formulation
High-Build Coverage
Low Application Odor
Impervious Seamless Finish

견적 요청 제품 찾아보기

상품 소개

Solvent-free high-build epoxy flooring uses a two-component thermosetting resin with very high solids content, so the applied material remains in the finished film rather than losing thickness through solvent evaporation. It is rolled, squeegeed or lightly filled depending on the required build and texture. The cured layer seals concrete against dust, oils and routine process splashes while creating a bright, easy-to-clean surface suited to enclosed rooms where strong solvent odor and extended ventilation are undesirable.

주요 기능

High solids content allows a substantial dry film to be achieved with limited shrinkage from evaporation.

The absence of added solvent reduces application odor in enclosed refurbishment and production spaces.

The continuous thermoset film resists routine oils, detergents and dilute process splashes better than bare concrete.

Roller, squeegee and aggregate-broadcast variants allow smooth hygienic areas and textured traffic zones to share one resin chemistry.

고객 제품 관심사

Enclosed facilities often need a durable resin finish without the odor, film loss and long ventilation period associated with solvent-bearing coatings.

Strong coating odor disrupts adjacent controlled rooms during refurbishment.A solvent-free high-solids binder minimizes solvent vapor and reduces odor at the application stage.

A wet coating dries much thinner than expected and leaves weak spots over the concrete profile.Near-total solids remain in the film, supporting predictable high-build coverage at the specified consumption.

Liquid penetrates hairline pores and stains an unsealed concrete slab.Primer plus a continuous epoxy body coat closes surface porosity and provides an impermeable finish.

Different rooms require both smooth cleaning and added traction.The same high-build resin can receive a smooth back-roll or a compatible aggregate broadcast and seal coat.

일반적인 응용 프로그램

Occupied cleanroom refurbishmentsPharmaceutical support spaces실험실 서비스 복도Controlled warehouses의료용 포장실

기술 매개변수

Typical construction data for a solvent-free, high-build epoxy floor over prepared concrete are listed below.

핵심 재료	Two-part 100% solids pigmented epoxy resin with optional fine silica filler
패널 두께	0.6–1.5 mm total cured system thickness
유효 폭	Typically 3000–4500 mm squeegee application bay width
최대 길이	Typically up to 18000 mm uninterrupted placement between substrate joints
강철 면면 두께	0 mm; no steel sheet is incorporated in the resin build-up
코어 밀도	Approximately 1350–1550 kg/m³ for mixed pigmented epoxy
열전도도 (Thermal Conductivity)	Typically 0.25–0.40 W/(m·K) for the cured high-build epoxy
표면 마무리	Smooth high-gloss, low-sheen or fine-textured pigmented epoxy
접합 유형	Seamless primer-and-body-coat system with reinforced coves and sealed slab joints
사용자 정의	의도된 응용 프로그램 및 운영 환경에 따라 사용할 수 있습니다.

사용 가능한 옵션

Smooth roller or textured broadcast finishClear or pigmented seal coatCoved skirting and wall-return detailsStandard gray, blue, green and custom color ranges

Planning a Solvent-Free High-Build Epoxy Flooring specification?

치수, 설치 조건, 성능 목표 및 필요한 표면 마감을 보내십시오.

우리 팀과 대화하십시오.