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ガススクラバー
Compact point-of-use gas scrubber cabinet for treating a selected water-soluble or water-reactive semiconductor process exhaust close to the vacuum pump before connection to the facility exhaust.
- Point-of-use treatment close to the process exhaust source
- Integrated wash tower, recirculation pump and monitored utilities
- Up to four heated inlet paths on the selected compact basis
商品紹介
The Gas Scrubber is a self-contained point-of-use exhaust-abatement cabinet for selected semiconductor, photovoltaic and clean-manufacturing processes. Process effluent enters through heated inlet paths designed to reduce by-product accumulation, passes through a water-contact section, and leaves through a treated-gas connection to the facility exhaust. An internal wash tower, recirculation pump, water and drain circuit, nitrogen service and cabinet ventilation operate as one monitored package. Because gas solubility, hydrolysis, reaction products and cross-chemistry vary substantially, the inlet arrangement, scrubbing liquid, pH strategy, purge logic and wastewater handling are selected for the actual process rather than assumed from the cabinet size alone.
主要な特徴
Four heated inlet positions on the selected basis help accommodate multi-chamber tools while limiting cold deposition near the entry
A first shower stage and vertical wash-water contact section provide controlled gas-to-liquid interaction
Magnetic-drive recirculation avoids a conventional shaft seal in the circulating liquid path
A bypass-valve signal can be interlocked with process and vacuum equipment for defined abnormal-state routing
Vented safety enclosure directs cabinet air to the facility exhaust rather than the occupied service area
Water flow, drainage, nitrogen and cabinet ventilation can be supervised as operating permissives
In-situ washing provisions reduce the need to dismantle inlet and wet-contact components for routine deposit removal
Optional pH dosing supports chemistry control when the selected contaminant and wastewater plan require it
Compact vertical packaging preserves service access while minimizing sub-fab floor area
お客様の製品に関する懸念事項
A compact scrubber performs reliably only when the gas chemistry, inlet segregation, water quality, drainage, exhaust and interlocks are engineered as one process rather than treated as independent utility connections.
Mixing exhausts from different chambers can form heat, solids or unstable by-products before the wet stage can control themReview the complete recipe matrix and keep incompatible inlet paths isolated until the streams are demonstrably safe to combine.
Cold inlet surfaces can accumulate condensate or reaction solids and progressively restrict process exhaust flowUse heated inlets where compatible, monitor pressure behavior and include an in-situ cleaning sequence matched to the deposited material.
Loss of water circulation, drainage or cabinet exhaust can leave the process running without effective abatementInterlock verified water flow, pump state, drain availability and cabinet ventilation with the process-tool permissive and bypass logic.
A scrubbing liquid that removes one gas may react poorly with another gas or create an unacceptable wastewater streamSelect the liquid chemistry and any pH dosing from the actual gas composition, reaction products and site wastewater controls.
Operators may not know whether an alarm is caused by the process inlet, wash loop, utilities or facility exhaustProvide distinct local and remote status for inlet temperature, recirculation, water, drain, nitrogen, cabinet ventilation and exhaust conditions.
Routine service can expose personnel to residual gases, contaminated liquid or reactive deposits inside the cabinetUse an approved purge and isolation sequence, verify zero-energy and safe chemistry conditions, and service the wet section using task-specific protective controls.
典型的な用途
Semiconductor epitaxy exhaust containing reviewed water-reactive chlorosilane by-productsCVD and ALD process-tool exhaust with selected halide or ammonia serviceMetal and dielectric etch exhaust requiring local wet-contact treatmentPhotovoltaic cell production tools using compatible reactive process gasesResearch-scale wafer fabrication and pilot semiconductor linesClean-manufacturing process tools requiring a compact local gas-abatement stage
技術的なパラメータ
The displayed product basis is a compact point-of-use water-scrubbing cabinet derived from the published G-WS1000 envelope: approximately 914 mm wide, 736 mm deep and 1727 mm high. The candidate combines a powder-coated service enclosure with a PP-H wash tower and piping, a magnetic-drive recirculation pump, four heated inlet positions and separate water, drain, nitrogen, ventilation and treated-gas connections. The site's fixed ten-row schema uses panel-oriented labels; Panel Thickness therefore records overall cabinet depth and the material rows describe the representative PP-H wet-contact components rather than abatement performance. Gas list, inlet assignment, liquid chemistry, utilities and interlocks remain process-selected.
| コア材料 | PP-H wash tower and recirculation piping inside a powder-coated steel service enclosure, with corrosion-resistant pump and selected stainless process interfaces |
|---|---|
| パネルの厚さ | 736 mm nominal overall cabinet depth for the selected point-of-use catalogue basis |
| 有効幅 | 914 mm nominal overall cabinet width for the selected point-of-use catalogue basis |
| 最大長さ | 1727 mm nominal overall cabinet height, excluding utility connections and required service clearance |
| 鋼鉄の厚さを直面する | 1.0-1.2 mm nominal powder-coated enclosure sheet for the displayed candidate; final gauge depends on the selected cabinet construction |
| コア密度 | Approximately 915 kg/m³ representative density for the PP-H wet-contact material |
| 熱伝導率 | Approximately 0.22 W/(m·K) representative value for PP-H near ambient temperature |
| 表面仕上げ | Warm off-white powder-coated cabinet, pale-gray PP-H wet section, natural-silver inlet stubs, blue magnetic-drive pump and restrained functional indicator colors |
| ジョイントタイプ | Heated process-inlet stubs and treated-gas collar with welded PP-H water circuit, service unions, flanged exhaust connection and separate water, drain and nitrogen interfaces |
| カスタマイズ | 意図したアプリケーションと動作環境に基づいて利用できます。 |
利用可能なオプション
One to four segregated heated process-inlet pathsGas-specific inlet temperature and purge logicWater-only or compatible chemically dosed scrubbing circuitAutomatic pH monitoring and dosing where appropriateProcess-tool, dry-pump and bypass-valve interlock packagesWater-flow, level, drain and recirculation-pump supervisionCabinet ventilation and facility-exhaust pressure monitoringRemote alarm contacts and fieldbus status integrationIn-situ wash and deposit-management sequencesAlternative corrosion-resistant wetted materials after compatibility review
Planning a Gas Scrubber specification?
寸法、設置条件、性能目標、必要な表面仕上げをお送りください。
