ESD Heel Grounder
- Molded heel cup provides repeatable floor contact.
- Conductive ribbon links the wearer through the shoe interior.
- Adjustable retention strap supports secure reusable fitting.
Produkteinführung
A layered rubber cup wraps the shoe heel and contacts the floor, while a conductive ribbon runs inside the shoe beneath the wearer. The adjustable hook-and-loop strap keeps the assembly in place during walking. Units are normally worn on both feet and verified as part of the complete person-footwear-floor system.
Key Features
Non-marking inner layer protects common footwear finishes.
Bright ribbon makes correct routing easier to inspect.
Adjustable strap accommodates varied shoe profiles.
Replaceable, reusable construction suits controlled-area entry.
Optional current-limiting resistor supports site-specific configurations.
Kunden Produktbedenken
Heel-grounder performance depends on secure fit, correct ribbon placement, two-foot use and reliable contact with a verified ESD floor.
Typische Anwendungen
Technische Parameter
These representative values describe a reusable cup-style grounder; sole structure, ribbon length, resistor and closure can be configured for the footwear program.
| Core Material | Two-layer conductive and static-dissipative rubber with polyester ribbon |
|---|---|
| Panel Dicke | 1.5–3.0 mm rubber contact thickness |
| Effektive Breite | 32–65 mm heel-contact width |
| Maximale Länge | Up to 760 mm conductive ribbon length |
| Stahl facing Dicke | 0.5 mm nominal stainless snap shell thickness |
| Kerndichte | 1050–1250 kg/m³ rubber compound density |
| Thermische Leitfähigkeit | 0.13–0.20 W/(m·K) |
| Oberfläche Finish | Black non-marking molded cup, black woven strap and yellow ribbon |
| Gemeinsamer Typ | Repositionable heel cup with hook-and-loop strap and snap-secured ribbon |
| Customisierung | Verfügbar je nach beabsichtigter Anwendung und Betriebsumgebung. |
Verfügbare Optionen
Planning a ESD Heel Grounder specification?
Senden Sie uns Ihre Abmessungen, Installationsbedingungen, Leistungsziele und gewünschte Oberflächenveredelung.

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