Bulk removal followed by polishing
Double-pass RO, EDI and the polishing mixed bed divide the ion-removal duty between successive stages.
PRODUCT GALLERYST
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Cleanroom Pure Water Systems
Integrated Circuit Ultrapure Water System – ST-LPW46 Series
Product specifications
| Brand | ST |
|---|---|
| Public model series | ST-LPW46 |
| Primary process | double-pass RO + EDI + polishing mixed bed |
| Final water quality | Project-specific electronic-grade water |
| Pretreatment | Media filtration, activated carbon, softening and precision filtration |
| Control | Automatic control with tank-level and pump-pressure protection |
| Online monitoring | Product-water quality |
Customization availableSpecifications can be customized to your requirements.
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Specify the quantity and configuration in your inquiry.
Integrated Circuit Ultrapure Water System – ST-LPW46 Series arranges ultrapure-water treatment around the contamination requirements of wafer, photomask and process-tool rinsing. It is a process-specific utility project rather than a single universal water grade for every integrated-circuit operation.
The double-pass RO, EDI and polishing route addresses dissolved ions; particle, organic and other required limits must also be part of the selected final-water design. The tool demand determines generation, storage and return-loop capacity.
FEATURES AND BENEFITS
How it helps
Quality changes visible online
The water-quality instrument helps operators follow changes in the process supply during operation.
Automated pretreatment
Automatic operation coordinates the upstream treatment stages that prepare incoming water for the membrane system.
APPLICATION ENVIRONMENTS
Where this configuration is used
Integrated Circuit Ultrapure Water production
Supplies controlled water for wafer, photomask and process-tool rinsing.
Electronic materials
Supports compatible material, component and tooling rinses where dissolved ions can affect yield.
Precision cleaning
Provides the selected grade for final rinsing where residues, particles or ionic background must be limited.
SELECTION GUIDANCE
Choosing the configuration
Tool acceptance limits
Set the tool requirements for resistivity, TOC, silica, particles and trace metals before selecting final treatment. Use the combined demand of connected tools to determine the supply and distribution capacity.
PROCUREMENT / INQUIRY
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