Wafer packing
Separate compatible wafers or packing layers during storage and transfer.
PRODUCT GALLERYST
Product view
Cleanroom Consumables
Wafer Separator Paper
Product specifications
| Brand | ST |
|---|---|
| Product type | Wafer Separator Paper |
| Application environment | Class 10–100 |
Customization availableSpecifications can be customized to your requirements.
Request a quotation
Specify the quantity and configuration in your inquiry.
Wafer Separator Paper places a low-shedding separation layer between wafers or packing surfaces. Its flexible continuous-fibre structure cushions contact during packing and handling, helping prevent direct face-to-face rubbing in a stacked arrangement.
MODELS AND DIMENSIONS
Available models and supplied specifications
| Product | Model | Specification | Packaging |
|---|---|---|---|
| Wafer separator paper | ST-CS393-01 | Round; selectable size | 200 sheets/pack |
Other dimensions, packing formats or configurations can be customized for the application.
APPLICATIONS
Where it is used
Semiconductor handling
Provide a controlled contact layer in packaging assemblies where ordinary paper is unsuitable.
FEATURES AND BENEFITS
How it helps
Round separator format
A circular piece follows the wafer packing geometry without excess sheet corners.
Continuous fibres
The fibre structure is intended to limit loose paper debris in the package.
Antistatic treatment
The treated material supports packaging procedures for static-sensitive parts.
SELECTION GUIDANCE
Choosing the configuration
Match the packing diameter
Choose the separator to fit the wafer and container so it stays flat without folding into the contact area.
PROCUREMENT / INQUIRY
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product quotation.
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