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Cleanroom Consumables

Patterned Wafer Separator Paper

Product specifications

BrandST
Product typePatterned Wafer Separator Paper

Customization availableSpecifications can be customized to your requirements.

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Specify the quantity and configuration in your inquiry.

Patterned Wafer Separator Paper provides an antistatic-treated, continuous-fibre contact layer for wafer packing. The patterned sheet helps keep surfaces apart and limits loose fibre from ordinary packing paper during stacking and transfer.

MODELS AND DIMENSIONS

Available models and supplied specifications

Patterned Wafer Separator Paper supplied specification table
ProductSpecification
5 in patterned wafer separatorDiameter: 127mm
6 in patterned wafer separatorDiameter: 152.4mm
8 in patterned wafer separatorDiameter: 203.2mm
10 in patterned wafer separatorDiameter: 254mm

Other dimensions, packing formats or configurations can be customized for the application.

MODEL DIFFERENCES

Which configuration fits the task

127 and 152.4 mm

The two smaller diameters fit the listed 5- and 6-inch formats.

203.2 and 254 mm

The larger discs cover the listed 8- and 10-inch formats with the same separator function.

APPLICATIONS

Where it is used

01

Wafer storage

Separate compatible faces in a defined packing stack.

02

Controlled semiconductor packing

Replace ordinary paper interleaves where fibre and static control matter.

FEATURES AND BENEFITS

How it helps

Continuous-fibre web

The spunbond structure forms a strong separation sheet for repeated packing movements.

Smooth packing contact

The surface is intended to contact compatible wafers without a coarse paper texture.

Defined wafer formats

Circular sizes follow the listed 5-, 6-, 8- and 10-inch arrangements.

SELECTION GUIDANCE

Choosing the configuration

Diameter and seating

Match the disc to the wafer holder so no edge folds back into the contact area.

PROCUREMENT / INQUIRY

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YOUR PRODUCTPatterned Wafer Separator PaperReview specifications
Useful details for this quotation

Include the separated component and contact requirements so interleaf material and cut size can be matched.

  • Wafer or component dimensions
  • Contact-surface requirement
  • Material and format
  • Pack format

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Patterned Wafer Separator Paper — product view

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