The specifications for waferfab cleanrooms go beyond raw airflow and particle control. Everything from tool placement to flooring has an effect.

Layouts: Bay & chase vs ballroom configurations adapted to workflow and tool count.
Raised Access Floors (RAF): Better air flow, cable management, and adaptability for tool location.
Ceiling Coverage: With FFUs and plenum modules, 100% filter coverage for laminar airflow.
Mini-Environments: Dedicated mini-chambers for the most sensitive equipment, an additional layer of protection.
Materials: Trace-metal-free construction to safeguard wafers from contamination.
EMI & Static Control: Shielding and grounding to protect sensitive lithography and metrology equipment.
Vibration Management: Non-active areas that isolate high resolution processes from environmental effects.
Toxic Gas Monitoring: Constant monitoring and compliance for operator safety.
Comfort Issues: Systems with noise reduction and radiant cooling to make operators more productive. These are not theoretical features. They impact your bottom line, yields, and compliance.
BAS/BMS Integration: Building automation and monitoring systems that keep environmental conditions stable.
High-Purity Gas Distribution: Cabinets, panels, and enclosures designed to deliver contaminant-free gas reliably, built to last over time.
Ultra-Pure Water (UPW): Skids and loops delivering contaminant-free water required for wafer rinse/detergent.
Scrubbed Exhaust & Chemical Processing: Recover corrosive byproducts without contaminating the process.
Environmental Monitoring: Particle, humidity, and temperature data in real time for quick decision making. When that integration is successful, fabs can also achieve greater throughput while minimizing the number of unplanned down periods.

Waferfab cleanrooms are the enabling environment for the technologies that drive modern life:

Semiconductor Device Fabrication: Fabs and foundries that manufacture chips for consumer electronics, automotive systems, and cloud computing.
Pilot Lines & R&D: Facilities for testing new materials and process innovations before moving into high-volume production.
Compound Semiconductors: Processing of GaAs and GaN for advanced optoelectronics, RF devices, and power electronics.
Nanotechnology & Microelectronics Cleanrooms: Spaces for emerging technologies such as sensors, MEMS, and nanofabrication.
Key Process Areas: Photolithography bays, deposition areas, and metrology labs requiring ultra-clean, vibration-free environments.
Regardless of the application, every case emphasizes one fact: without a well-designed cleanroom, progress comes to a standstill.

Different waferfab processes require different ISO classifications:

ISO 4 (Class 10): 300–540 ACPH
ISO 5 (Class 100): 240–480 ACPH
ISO 6 (Class 1,000): 150–240 ACPH
ISO 7 (Class 10,000): 60–90 ACPH
ISO 8 (Class 100,000): 5–48 ACPH
Service areas usually require a lower classification but connect seamlessly to the fab. Laminar airflow and HEPA/ULPA filters maintain performance throughout, protecting wafers at every stage.

The wrong choice for your cleanroom partner doesn’t only affect costs but may also impair competitiveness. Our nanofabrication cleanroom solutions deliver:

Scale: Designed for pilot-scale installations and high-volume fabs.
Velocity: Prefabricated and modular models slash lead times while providing precision grinding.
Compliance: ISO 4–8 rating, as well as ESD and trace-metal free.
Accuracy: Designed to reduce vibration, EMI, and risks to static-sensitive equipment.
Ready to Use: Delivered turnkey, covering design, engineering, commissioning, and integration.
These advantages don’t only protect wafers, they protect investments.

No two fabs are the same, and there is no one-size-fits-all approach to being successful. Some of our customization choices include:

Build Types: Modular (how fast? how big? how permanent?) vs stick-built.
Materials: FR-rated wall panels, epoxy flooring, and ESD-protected surfaces.
HVAC: Precise humidity control and air flow for sensitive operations.
Utility Integration: Gas, water, and chemical systems designed to support seamless, integrated operation.
Control Systems: BAS/BMS interfacing, alarms, and monitoring for each site. Adapting the cleanroom to the process, rather than forcing the process into the cleanroom, ensures facilities run at peak performance from day one.

There is no doubt that building or upgrading a wafer plant is one of the most important investments a company can make. The cleanroom is more than infrastructure; it is the basis of every process, every yield, and every new idea. You’re investing in expert design, integration, and compliance that allows your fab to perform today while staying adaptable tomorrow.

Ideal for high-capacity production or cutting-edge research, wafer cleanrooms are the foundation of success in the semiconductor industry.

Cleanroom design is money invested to production capacity. Inadequate facilities result in contamination, downtime, and underperformance. In contrast, a well-designed wafer fabrication cleanroom minimizes downtime, lowers risk, and increases yields. They are also quicker to certify and get into operation, which translates into higher revenue sooner.

Over time, they also reduce operating costs and strengthen your competitive position in the market.